25 November 2019
Telecoms, Datacoms, Wireless, IoT
NXP Semiconductors announced the broad availability of a comprehensive RF power multi-chip module (MCM) portfolio supporting the development of massive MIMO (mMIMO) active antenna systems for 5G base stations. NXP’s 5G Airfast solutions bring higher levels of integration that reduce power amplifier size, shorten design cycles and simplify manufacturing.
The RF power multi-chip modules are 50 Ω in/out, two-stage devices with integrated Doherty that help remove RF complexities, eliminate multiple prototype passes and improve design predictability. Their pin-compatibility enables strong design reuse. The reduction of component count avoids testing redundancies while improving yields and decreasing qualification cycle time.
With a 5x reduction in printed-circuit board size compared to traditional RF designs, NXP’s integrated solutions help tackle the size and weight challenge of high-order mMIMO, such as 64T64R that needs to include 64 power amplifiers per antenna.
The Airfast integrated portfolio includes LDMOS power amplifier modules, GaAs/SiGe pre-driver modules and receiver modules for cellular frequency bands from 2,3 GHz to 3,8 GHz, with output power from 3 W to 5 W. The power amplifier modules are supported by NXP’s new RF Circuit Collection, a digital library of over 400 RF power reference circuits.
Wi-Fi 6/BLE module enables rapid development Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi 6, and dual-mode Bluetooth/BLE.
Read more...Low phase noise amplifier RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
The MAAL-011158 from Macom is an easy-to-use low-phase noise amplifier that provides 12 dB of gain in a 32-lead QFN plastic package.
Read more...Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Bridging the gap between MCUs and MPUs Future Electronics
Editor's Choice AI & ML
The Renesas RA8 series microcontrollers feature Arm Helium technology, which boosts the performance of DSP functions and of AI and machine learning algorithms.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
Read more...Enhanced code protection for USB µC portfolio Future Electronics
DSP, Micros & Memory
To help easily incorporate USB power and communication functionality into embedded systems, Microchip Technology has launched the AVR DU family of microcontrollers.
printer friendly version