High-efficiency linear power amplifier modules

21 April 2004 Telecoms, Datacoms, Wireless, IoT

RF Micro Devices RF3163, RF3164 and RF3165 linear power amp modules are manufactured on an advanced third-generation GaAs HBT process, for 824-849 MHz, 1850-1910 MHz, and 1750-1780 MHz applications respectively. Measuring 3 x 3 x 0,9 mm, the PA modules are based upon RFMD's 'lead frame module' packaging technology, which eliminates surface mount devices and the associated costs of SMT device placement by integrating the functionality of passive components into the GaAs die. Applications for the modules include 3 V IS-95/CDMA 2000 1X handheld digital cellular equipment and spread-spectrum systems. The PAs feature MSM-driven digital control lines to lower quiescent current for increased talk time in low power conditions.

RF Design, 021 762 5365

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