New hybrid assembly technique said to be simple

21 February 2007 Manufacturing / Production Technology, Hardware & Services

The Centre for Integrated Photonics (CIP) has announced a hybrid assembly technique which offers a very simple reliable method of integrating optical devices. The technique eliminates the expense of actively aligning devices - the process in common use today - providing a platform for creating the building-blocks required for advanced optical networking.

Graeme Maxwell, CIP's VP of hybrid R&D, said: "Hybrid integration is an optimal way forward for many of the optical functions needed in advanced optical networks, but most of the assembly techniques in mainstream use today rely on highly skilled labour and expensive equipment, and do not scale. Our technique requires just passive assembly, yet provides very low insertion losses - making it possible to create single-module solutions for applications such as packet switches and signal regenerators."

The technique integrates by means of plugging silicon daughterboards carrying individual optical components into a planar silica motherboard - each having precision-machined mating faces. The components themselves also employ interface modifications, namely mode expansion, and features to support precision cleaving. The result turns hybrid photonic integration into a similar form of process to that used for assembling electronic PCBs - with the planar silica motherboard providing the equivalent of printed wiring.

"We believe this hybrid integration technique provides the performance, reliability and economy to address many of the sophisticated component functions necessary for advanced optical switched fabrics," adds Maxwell. "Among the potential applications are reconfigurable add-drop multiplexers, 2R and 3R signal regenerators, high-speed interconnect, packet switches, WDM PON devices and optical buffer memories. In each of these cases I expect our platform approach to offer considerable cost reduction and performance advantages over current component solutions and integration methods."

www.ciphotonics.com

Further reading:

World-first 016008 mm component placement
Manufacturing / Production Technology, Hardware & Services
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.

Read more...

---

Lifecycle and obsolescence: Protecting electronics through process
Production Logix Manufacturing / Production Technology, Hardware & Services
At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.

Read more...

---

Maximising squeegee quality and durability
Testerion Manufacturing / Production Technology, Hardware & Services
Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.

Read more...

---

NeoDen ND2 PCB screen printer
ZETECH ONE Manufacturing / Production Technology, Hardware & Services
The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.

Read more...

---

Understanding the BGA rework process
Techmet Manufacturing / Production Technology, Hardware & Services
BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.

Read more...

---

Flexible three-process reflow soldering system
Truth Electronic Manufacturing Manufacturing / Production Technology, Hardware & Services
By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.

Read more...

---

Inline vapour phase soldering for high-volume production
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.

Read more...

---

Global electronics solutions since 1964
IMP Electronics Solutions Manufacturing / Production Technology, Hardware & Services
Over more than six decades, IMP Electronics Solutions has built a reputation for technical expertise, reliable supply chains, and strong partnerships with both customers and manufacturing partners.

Read more...

---

Driving excellence in electronics manufacturing
Jemstech Editor's Choice Manufacturing / Production Technology, Hardware & Services
Jemstech’s reputation for disciplined execution and client-focused service has earned it strong loyalty from companies operating in demanding industries.

Read more...

---

When do you need Nitrogen in reflow?
Truth Electronic Manufacturing Manufacturing / Production Technology, Hardware & Services
Nitrogen in reflow soldering is often seen as a performance enhancer, offering improved wetting, shinier joints, and fewer defects. But it is not always necessary.

Read more...

---