In addition to heatsinks for surface-mounted electronic components with casings D PAK (TO252), D2PAK (TO263) and D3PAK (TO268), Fischer Elektronik has developed special SMT heatsinks to suit casings for the LFPAK product line.
Based on an initial power MOSFET design for DC-DC converters, these LFPAK (loss-free package) casings have a smaller overall size and a better performance. Heatsinks by Fischer Elektronik are adapted to these sizes and they are especially suitable for SOT 669 and SO IC-8 FL MP designs, a great number of Power SO types, SO-8 and many others.
LFPAK heatsinks are made from copper and provided with a solderable surface finish. They can be directly soldered to the heat conductive Cu surface of the PCB. The conductive surface may be freely designed, as no drill holes are required in the PCB. As it operates on the principle of indirect heat radiation, the heatsink has no direct contact with the component. It can thus be easily integrated into the pick-and-place and soldering processes with its tape and reel packaging, in the same way as any other SMT component.
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