Manufacturing / Production Technology, Hardware & Services


Solder paste jet printer

13 May 2009 Manufacturing / Production Technology, Hardware & Services

With its second generation of the MY500 series, Mydata has developed a jet printer capable of shooting solder paste with-out touching the PCB.

Because jet printing requires no stencils, this offers many advantages over the standard screen printer, such as more PCB design freedom and virtually no change-over or lead times. Solder paste deposits can be adjusted on-the-spot in three dimensions.

The system features an easy-to-use two-dimensional inspection and repair functionality. To maximise uptime during a production run, the MY500 paste syringe and ejection technology features the ease and speed of ‘snap-to-machine’ loading. This allows the user to quickly refill paste when needed or switch from lead to lead-free solder paste in seconds.

No tools are needed to change the solder paste cassettes – the user simply releases the snap lock, removes the old cassette and snaps a new one into place. The electronic ID barcode label and cassette memory make machine settings automatic as well. Once the paste code type is entered in the software program, printing is ready to begin again.

Because the touchless jet printing technology applies no force to the PCB, no support pins are needed. The print program automatically aligns and adjusts to the board stretch based on the fiducials. In addition, the cassette calibration and temperature control ensure that the proper viscosity of solder paste can be maintained, which in turn leads to higher levels of application accuracy.



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