MA-COM offers a range of SMT components developed using a unique approach to the packaging and integration of ultra-wideband switches, such as the MASW-002103 (SPDT), MASW-003103 (SP3T) and MASW-004103 (SP4T) which deliver enhanced RF and thermal performance.
Switches packaged using standard plastic packaging techniques continue to have upper frequency range limitations, as well as repeatability issues caused by die attach, and chip and wire assembly techniques. M/A-COM’s HMIC technology utilises semiconductor wafer-scale processes to realise repeatable broadband monolithic surface-mount devices.
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The IR315 combines 4G LTE, Wi-Fi, Ethernet, and VPN technologies into a rugged, industrial-grade platform that enables seamless connectivity across a wide range of applications.
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