The HiLo 3G, Sagemcom’s latest generation 3G offering, is an HSDPA module designed for large-scale M2M application deployments in automotive, energy, payment terminals, healthcare, as well as alarms and security markets.
With its 900 MHz band, the module enables machines to overcome 3G coverage obstacles in rural areas, as well as inside buildings. Two 3G bands and the four 2G bands have been integrated to guarantee optimised operational functionality regardless of the specific environmental conditions. Thanks to a design that is compatible with the HiLo GPRS, M2M devices integrating HiLo are easily scalable to HiLo 3G.
The HiLo 3G has a surface area of just 27 x 27 mm, is just 4,8 mm high and weighs less than 5 grams. It can also handle the four GSM, GPRS and EDGE frequency bands and delivers high sensitivity together with low power consumption. Developed according to the demanding standards applicable for the automotive market, the module operates from -40°C to +85°C.
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Macom’s MADU FR1012 is a GaAs MMIC 1-bit true time delay device covering 4 GHz to 12 GHz, designed for broadband microwave systems where beam accuracy and signal integrity are critical.
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In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.
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Microchip Technology has expanded its atomic clock portfolio with the radiation-tolerant Space CSAC-SA65, a Chip Scale Atomic Clock designed to deliver precise timing for space systems.
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With 400 MHz instantaneous bandwidth and support for carrier frequencies up to 23,6 GHz, Vertex 6.0 is the industry’s first channel emulator designed for next generation 6 G and Wi-Fi 7/8 testing.
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