Manufacturing / Production Technology, Hardware & Services


Thermoplastic circuit materials

13 April 2011 Manufacturing / Production Technology, Hardware & Services

Rogers Corporation introduced new SYRON 7000 and 7100 high-performance circuit materials, engineered for applications that demand high-temperature stability. The laminates are characterised by a considerably higher melt temperature than PTFE circuit materials, with an estimated Underwriters’ Laboratory (UL) relative thermal index (RTI) of greater than 210°C.

The materials are inherently flame retardant and, being halogen-free and compatible with lead-free solder processes, are also environmentally friendly. They are resistant to the solvents and reagents commonly used in printed circuit board processing and can operate in harsh chemical environments. SYRON laminates are designed for environments with a high maximum operating temperature and are ideal for circuits operating through microwave frequencies. They are suitable for flex-to-install applications, lightweight feed manifolds, automotive sensors and in electronics for oil and gas exploration.

The SYRON 7000 and SYRON 7100 materials differ somewhat in their electrical characteristics, although both are available with ½-oz, low-profile electrodeposited copper foil cladding and in several standard panel sizes, including 305 x 457 mm and 610 x 457 mm; other panel sizes and rolls are also available. The laminates are characterised by excellent coefficient of thermal expansion (CTE) and high thermal conductivity for consistent performance at high temperatures.

SYRON 7000 laminates feature a dielectric thickness of 0,0508 mm with thickness tolerance of ±12,5%. They exhibit a maximum z-axis dielectric constant of 3,4 at 10 GHz, with maximum z-axis dissipation factor of 0,0045 at 10 GHz. SYRON 7100 circuit materials are offered with dielectric thicknesses of 0,0508 mm and 0,1016 mm, both thicknesses held to a tolerance of ±12,5%. For the 0,0508 mm thick SYRON 7100 material, the maximum z-axis dielectric constant is 3,61 and the maximum z-axis dissipation factor is 0,006, both measured at 10 GHz. For the 0,1016 mm thick SYRON 7100 laminate, the maximum z-axis dielectric constant is 3,39 and the maximum z-axis dissipation factor is 0,005, also at 10 GHz.

For more information contact Andrew Hutton, RF Design, +27 (0)21 555 8400, sales@rfdesign.co.za, www.rfdesign.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Seeing through the noise
RF Design Editor's Choice Telecoms, Datacoms, Wireless, IoT
How Adaptive Long Coherent Integration (ALCI) delivers superior measurement and positioning performance where conventional receivers fall short.

Read more...
Bluetooth Classic and LE Audio module
RF Design Telecoms, Datacoms, Wireless, IoT
Refresh legacy Bluetooth designs and unlock Bluetooth Core 6.0 LE Audio in one rugged, ready to implement module.

Read more...
Centimetre-level navigation without RTK infrastructure
RF Design Telecoms, Datacoms, Wireless, IoT
From precision agriculture and infrastructure inspection to beyond visual line of sight missions, modern UAVs demand far greater positional reliability than standard GNSS systems can typically provide.

Read more...
Collaboration is now critical
RS South Africa Manufacturing / Production Technology, Hardware & Services
The message emerging from RS Connect is clear: Organisations can no longer rely on internal optimisation alone to secure performance. Competitive advantage is increasingly being determined by the strength of external relationships, shared capability and coordinated action across value chains.

Read more...
Disruption is the new normal. Effortless is the new competitive advantage.
Seven Labs Technology Manufacturing / Production Technology, Hardware & Services
Global supply chains have been under pressure for years. The manufacturers still standing are the ones who stopped waiting for normal to return, and started building something better.

Read more...
Axon NPU powers smarter edge
RF Design AI & ML
The nRF54LM20B from Nordic Semiconductor is an ultra-low-power wireless SoC that combines advanced edge AI capabilities with robust radio connectivity and rich peripheral support.

Read more...
Compact Ka-band GaN PA
RF Design Telecoms, Datacoms, Wireless, IoT
The CMX90A705 from CML Microcircuits is a high-performance two-stage GaN power amplifier operating across 27,5 to 31 GHz and targeting Ka-band applications.

Read more...
World-first 016008 mm component placement
Manufacturing / Production Technology, Hardware & Services
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.

Read more...
Lifecycle and obsolescence: Protecting electronics through process
Production Logix Manufacturing / Production Technology, Hardware & Services
At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.

Read more...
Maximising squeegee quality and durability
Testerion Manufacturing / Production Technology, Hardware & Services
Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved