Texas Instruments has premiered its first module platform housing the WiLink 6.0 (WL1271) single-chip, wireless combo solution with TI’s open source, Linux-based OpenLink drivers. The OpenLink drivers are built on the community-validated mac80211 Wi-Fi driver and BlueZ Bluetooth protocol stack.
The first in a series of such open source platforms from TI, the new WiLink 6.0 OpenLink platform is pre-integrated with TI’s AM18x Sitara ARM microprocessors (MPUs). This enables customers developing industrial or point-of-service applications on cost-effective ARM MPUs to easily introduce reliable, low-power Wi-Fi and Bluetooth wireless technologies. As a result, products built on Sitara ARM MPUs can serve as a mobile Wi-Fi gateway or support peer-to-peer file transfers with other Wi-Fi enabled devices. These capabilities eliminate the need for external access points and create opportunities for unique use cases depending on mobile, self-networking devices.
The AM18x Sitara ARM EVM + WL1271 development kit is the latest version of TI’s original AM18x Sitara ARM EVM and includes elements that create a quick-start experience right out of the box.
Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
Read more...General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
Read more...AI-native IoT platform launched EBV Electrolink
AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
Read more...Serial SRAM up to 4 MB EBV Electrolink
DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
Read more...Long-range connectivity module Avnet Silica
Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.
Read more...4G LTE-M/NB-IoT connectivity reference design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Developed around the industry-leading Nordic nRF9160 module, the platform comes complete with a newly-developed LTE antenna, ATRIA, which is pre-certified to operate over the full LTE-M and NB-IoT bands.
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