Espressif has released ESP32-C6, its first Wi-Fi 6 SoC integrating 2,4 GHz Wi-Fi 6, Bluetooth 5 (LE) and the 802.15.4 protocol. ESP32-C6 consists of a high-performance 32-bit RISC-V processor, which can be clocked up to 160 MHz, and a low-power 32-bit RISC-V processor, which can be clocked up to 20 MHz. It has 320 kB ROM, 512 kB SRAM, and works with external flash. Depending on the package, it comes with either 30 (QFN40) or 22 (QFN32) programmable GPIOs, with support for SPI, UART, I2C, I2S, RMT, TWAI, PWM, SDIO, and Motor Control PWM. It also includes a 12-bit ADC and a temperature sensor.
ESP32-C6 has an integrated 2,4 GHz Wi-Fi 6 (802.11ax) radio that also supports the 802.11b/g/n standard for backward compatibility. ESP32-C6 supports the OFDMA mechanism for both uplink and downlink communications, while also supporting MU-MIMO for downlink traffic. Both these techniques allow working with high efficiency and low latency, even in congested wireless environments. Additionally, the Target Wake Time (TWT) feature of the 802.11ax standard enables ESP32-C6 customers to build battery-operated connected devices that can last for years, while staying permanently connected.
ESP32-C6 supports 20 MHz bandwidth for the 802.11ax mode and a 20/40 MHz bandwidth for the 802.11b/g/n mode. It brings in Wi-Fi 6 features, such as transmission efficiency and low power consumption, which provide concrete benefits for IoT devices. Additionally, Bluetooth 5 (LE) supports long-range operation through advertising extensions and coded PHY.
ESP32-C6’s support for IEEE 802.15.4 and Wi-Fi radios, along with Bluetooth 5 (LE) connectivity, enable customers to build Matter-compliant Wi-Fi end-point devices and Thread end-point devices, thus achieving interoperability in smart-home devices from multiple brands.
RSA-3072-based secure boot, AES-128/256-XTS-based flash encryption, digital signature and an HMAC peripheral for identity protection, as well as cryptographic accelerators for improved performance, is built in to the ESP32-C6. The Trusted Execution Environment (TEE) enables privilege separation when accessing different chip features and, therefore, provides a secure software separation.
ESP32-C6 achieves PSA-L2 iCorp Technologies
DSP, Micros & Memory
Espressif Systems recently announced that its ESP32-C6 microcontroller has achieved PSA Certified Level 2 (PSA-L2) security certification, making it the first RISC-V-based MCU to reach this level.
Read more...Microprocessor with integrated NPU Avnet Silica
DSP, Micros & Memory
The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.
Read more...Dual-core support in NECTO Studio
DSP, Micros & Memory
MIKROE recently announced that version 7.3.0 of its NECTO Studio Integrated Development Environment now supports dual-core MCUs, allowing designers to program and debug each core independently.
Read more...Post Quantum Cryptographic firmware library
DSP, Micros & Memory
The STM32 post-quantum cryptographic library enables developers to satisfy application requirements for any combination of data integrity, confidentiality, identification/authentication, and nonrepudiation.
Read more...Introducing the Quectel EG800Z series iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The EG800Z series is Quectel’s latest ultra-compact LTE Cat 1 bis module, designed to deliver reliable connectivity, low power consumption, and robust performance across a wide range of IoT applications.
Read more...MultiVolt series of oscillators Future Electronics
DSP, Micros & Memory
The ECS-3225MVQ from ECS Inc. is a compact, quartz-based MultiVolt oscillator designed for precision timing in automotive, industrial, and portable electronic systems.
Read more...Drive innovation with AURIX TriCore MCUs Future Electronics
DSP, Micros & Memory
Infineon’s AURIX TriCore family balances safety, performance, and energy efficiency to offer a scalable and future-ready portfolio.
Read more...Modules upgraded with Direct-to-Cell tech iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced that several of its LTE modules are now available with Direct-to-Cell (D2C) functionality, enabling devices to seamlessly connect to satellite networks.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.