The FGM840R is a cutting-edge MCU Wi-Fi 4 and Bluetooth combo module from Quectel. It has a built-in Cortex M33 and M23 dual-core processor with a main-core frequency of up to 200 MHz. The module supports IEEE 802.11a/b/g/n protocol and BLE 5.0, supporting both the 2,4 and 5 GHz frequency bands. The FGM840R integrates 512 kB RAM and 4 MB Flash storage.
This combo module is in an LGA form factor with an ultra-compact package size of 12,5 x 13,2 x 2,05 mm, which optimises the size and cost for end-products making it compatible across a wide range of designs.
It complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards, and supports comprehensive security such as TRNG (true random number generator), AES-128, TrustZone, Secure Boot and flash encryption.
Supporting up to 20 GPIO interfaces, which can be multiplexed as UART, SPI, I2C, ADC, PWM, SDIO and USB functions, the module provides flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios.
The trends driving uptake of IoT Platform as a Service Trinity IoT
Editor's Choice Telecoms, Datacoms, Wireless, IoT
IoT platforms, delivered as a service, are the key that will enable enterprises to leverage a number of growing trends within the IT space, and access a range of benefits that will help them grow their businesses.
Read more...ESP32-C6 achieves PSA-L2 iCorp Technologies
DSP, Micros & Memory
Espressif Systems recently announced that its ESP32-C6 microcontroller has achieved PSA Certified Level 2 (PSA-L2) security certification, making it the first RISC-V-based MCU to reach this level.
Read more...RF power amplifier RF Design
Telecoms, Datacoms, Wireless, IoT
The ZHL-20M2G7025X+ from Mini-Circuits is a 32 W power amplifier that operates from 20 to 2700 MHz and delivers a saturated output power of +45 dBm.
Read more...Introducing the Quectel EG800Z series iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The EG800Z series is Quectel’s latest ultra-compact LTE Cat 1 bis module, designed to deliver reliable connectivity, low power consumption, and robust performance across a wide range of IoT applications.
Read more...NeoMesh on LoRa CST Electronics
Telecoms, Datacoms, Wireless, IoT
Thomas Steen Halkier, CEO of NeoCortec, recently gave a keynote speech where he spoke about “NeoMesh on LoRa: Bringing true mesh networking to the LoRa PHY”.
Read more...Modules upgraded with Direct-to-Cell tech iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced that several of its LTE modules are now available with Direct-to-Cell (D2C) functionality, enabling devices to seamlessly connect to satellite networks.
Read more...USB/Ethernet smart RF power sensor RF Design
Telecoms, Datacoms, Wireless, IoT
The PWR-18PWHS-RC from Mini-Circuits is an RF power sensor that operates from 50 MHz to 18 GHz and is designed to capture pulsed and trace modulated signals with very high data resolution.
Read more...Tiny Bluetooth LE + 802.15 + NFC module RF Design
Telecoms, Datacoms, Wireless, IoT
Unleashing enhanced processing power, expanded memory, and innovative peripherals, the BL54L15µ from Ezurio is the ultimate choice for small and low power connectivity.
Read more...AI modules for edge intelligence Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom has introduced two new entry-level AI computing modules, the SIM8668 and SIM8666, designed to bring intelligent capabilities to lightweight, energy-efficient edge devices.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.