25 November 2019
Telecoms, Datacoms, Wireless, IoT
NXP Semiconductors announced the broad availability of a comprehensive RF power multi-chip module (MCM) portfolio supporting the development of massive MIMO (mMIMO) active antenna systems for 5G base stations. NXP’s 5G Airfast solutions bring higher levels of integration that reduce power amplifier size, shorten design cycles and simplify manufacturing.
The RF power multi-chip modules are 50 Ω in/out, two-stage devices with integrated Doherty that help remove RF complexities, eliminate multiple prototype passes and improve design predictability. Their pin-compatibility enables strong design reuse. The reduction of component count avoids testing redundancies while improving yields and decreasing qualification cycle time.
With a 5x reduction in printed-circuit board size compared to traditional RF designs, NXP’s integrated solutions help tackle the size and weight challenge of high-order mMIMO, such as 64T64R that needs to include 64 power amplifiers per antenna.
The Airfast integrated portfolio includes LDMOS power amplifier modules, GaAs/SiGe pre-driver modules and receiver modules for cellular frequency bands from 2,3 GHz to 3,8 GHz, with output power from 3 W to 5 W. The power amplifier modules are supported by NXP’s new RF Circuit Collection, a digital library of over 400 RF power reference circuits.
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