Altron Arrow

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more information about Altron Arrow

SoC dedicated to IoT data communication
31 May 2023, Telecoms, Datacoms, Wireless, IoT

The EMC308x Wi-Fi/BLE series modules by Shanghai MXCHIP are Matter-certified one-stop Internet of Things solutions mainly used for IoT data communication.
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140 W reference board design for USB-C chargers
31 May 2023, Power Electronics / Power Management

The reference board REF_XDPS2221_140W1 by Infineon was developed for USB-PD applications with a wide input range, and output voltage from 5 to 28 V.
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Flyback converter evaluation circuit
26 April 2023, Power Electronics / Power Management

he EVAL-LT8306-AZ evaluation circuit demonstrates the features of the LT8306 micro-powered no-opto-isolated flyback converter, which holds tight regulation with a load current from 15 mA to 2,0 A.
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Wireless prototyping with STM32WBA daughter board
26 April 2023, DSP, Micros & Memory

STMicroelectronics’ NUCLEO-WBA52CG is a Bluetooth Low Energy wireless and ultra-low-power board embedding a powerful and ultra-low-power radio compliant with the Bluetooth Low Energy SIG specification v5.3.
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STLink-V3 modular in-circuit debugger and programmer
26 April 2023, DSP, Micros & Memory

The STLINK-V3SET is a modular standalone debugging and programming probe for the STM8 and STM32 microcontrollers, from STMicroelectronics.
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MEMS accelerometer with integrated AI
26 April 2023, DSP, Micros & Memory

With embedded AI, integrated Qvar and anti-aliasing filter, the sensors themselves are able to provide context information.
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What is ML? – Part 2: Training convolutional neural networks
26 April 2023, AI & ML

In the first part, the CIFAR network, with which it is possible to classify objects such as cats, houses, or bicycles in images, or to perform simple voice pattern recognition, was discussed. Part 2 explains how these neural networks can be trained to solve problems.
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AcceleRate extreme density and performance systems
26 April 2023, Interconnection

Samtec’s board-to-board and cable assemblies feature extreme density with up to 1000 total I/Os on a 0,635 mm pitch, while still providing incredible 112 Gbps PAM4 performance.
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New connector system improves power integrity
26 April 2023, Editor's Choice, Interconnection

By optimising power integrity, Samtec’s new connector provides a greater signal integrity margin and improves power and thermal efficiency.
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MEMS and sensors ecosystem for ML
29 March 2023, DSP, Micros & Memory

STMicroelectronics has an ecosystem for machine learning (ML) in MEMS and sensors, which combines several hardware and software tools to help designers implement gesture and activity recognition with artificial intelligence (AI) at the edge.
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MCU with random-number entropy source certification
29 March 2023, DSP, Micros & Memory

STMicroelectronics has expanded its STM32 family of advanced microcontrollers (MCUs) with extra STM32U5 devices that raise performance, while squeezing power consumption for longer runtimes and energy efficiency.
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Maximising the RF performance of the STM32WL
29 March 2023, Telecoms, Datacoms, Wireless, IoT

Based on STMicroelectronics’ IPD technology on non-conductive glass substrate, its integrated baluns embed an impedance matching network and transmit harmonics filter customised to maximise the RF performance of STM32WL sub-GHz wireless microcontrollers.
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