Electrocomp

Tel: +27 11 458 9000
Email: [email protected]
www: www.electrocomp.co.za
more information about Electrocomp

USB host chip and application modules
15 May 2013, Telecoms, Datacoms, Wireless, IoT

FTDI has released a new USB host IC with Android compatibility, as well as two new application modules supporting its Vinculum-II 16-bit microcontroller with support for USB host and peripheral functionality. The ...
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DC link capacitors
15 May 2013, Passive Components

TDK has revealed EPCOS CeraLink, an innovative DC link capacitor for frequency converters. It is based on a PLZT ceramic material (lead lanthanum zirconate titanate) and covers a capacitance range from ...
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Fast recovery diodes
15 May 2013, EBV Electrolink, Power Electronics / Power Management

New from Infineon Technologies are the highly efficient, fast recovery 650 V Rapid 1 and Rapid 2 silicon diode families. Combining Infineon’s ultra-thin wafer manufacturing expertise for a low-loss ...
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High-density SMT headers
15 May 2013, Interconnection

Molex’s robust family of high-density 1,27 mm wire-to-board Picoflex headers and connectors, now with reverse PCB footprint SMT headers, offers space-saving solutions for a greater range of compact power ...
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High-voltage MOSFETs
1 May 2013, EBV Electrolink, Power Electronics / Power Management

With the new 650 V CoolMOS CFD2, Infineon has launched the second generation of its high-voltage CoolMOS MOSFET family with integrated fast body diode. The company also marked the occasion of the 3,5 ...
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Force guided relays
1 May 2013, Switches, Relays & Keypads

Force guided relays are key electromechanical switching components used within safety relay circuits. They enable the recognition of a contact’s switching condition in a simple and safe manner. With ...
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Tri-axis accelerometer
17 April 2013, Analogue, Mixed Signal, LSI

The KXCJA from Kionix is an ultra-thin tri-axis accelerometer measuring 3 x 3 x 0,7 mm and offering up to 14-bit resolution. User-selectable parameters include ±2 G, 4 G or 8 G ranges and output data ...
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Wireless 2G module in LGA format
17 April 2013, Telecoms, Datacoms, Wireless, IoT

The Cinterion BGS2 is a 2G LGA wireless module offering full voice capabilities, GPRS data transmission low power consumption, making it suitable for basic machine-to-machine (M2M) communications. The ...
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RFID tags in three formats
17 April 2013, Telecoms, Datacoms, Wireless, IoT

As part of its NeoTAG product range, Neosid produces a range of RFID tags in three different formats to suit various application requirements.    NeoTAG Inlay is the most compact and basic version, with ...
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Micro-SIM sockets
17 April 2013, Interconnection

Molex manufactures a range of push-push micro-SIM sockets for space-constrained applications.    The 503960 series has been independently tested by some of the major mobile manufacturers to achieve a contact ...
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IEC inlet filters
17 April 2013, Circuit & System Protection

TDK has expanded the EPCOS B84771* IEC inlet filter family with two new series: the B84773* series features an integrated fuse, while the B84776* series has both a switch and a fuse. All series are ...
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Through-board connector for LED lighting
3 April 2013, Interconnection

TE Connectivity announced the release of a new high-power inverted through-board SMT connector. This lighting interconnect solution provides a means to bring power to aluminium-clad and FR4 boards from ...
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