Electrocomp

Tel: +27 11 458 9000
Email: [email protected]
www: www.electrocomp.co.za
more information about Electrocomp

Next-generation energy measurement solution launched
7 March 2007, Altron Arrow, Future Electronics, Tempe Technologies, Analogue, Mixed Signal, LSI

Microchip's new MCP3909 energy-measurement IC combines low power consumption with an SPI interface and active power pulse output. As a part of the MCP3909 3-Phase Energy Meter Reference Design, the IC ...
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Need another supply other than VDD? With a CCP, it is as easy as ABC
7 March 2007, Altron Arrow, Tempe Technologies, Future Electronics, Power Electronics / Power Management

In many applications, the power supply voltage is often dictated by an external design constraint such as battery voltage, bus-powered USB or something as mundane as a single-output, low-cost wall wart. ...
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MAPS simplifies device selection for electronic designs
7 March 2007, Altron Arrow, Future Electronics, Tempe Technologies, News

The new Microchip Technologies' Advanced Product Selector (MAPS) Version 2.0 has debuted online, providing a comprehensive selection tool for the chip company's complete product portfolio including analog, ...
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Heatsinks for LEDs
7 March 2007, Opto-Electronics

In view of the widespread use of LEDs as indicators and in other lighting applications, a suitable means of heat dissipation is essential for proper functioning and a long service life. Fischer Elektronik...
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SMT heatsinks for LFPAK
7 March 2007, Power Electronics / Power Management

In addition to heatsinks for surface-mounted electronic components with casings D PAK (TO252), D2PAK (TO263) and D3PAK (TO268), Fischer Elektronik has developed special SMT heatsinks to suit casings for ...
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General-purpose small PIC microcontroller
7 March 2007, Altron Arrow, Future Electronics, Tempe Technologies, DSP, Micros & Memory

Claimed to be the lowest-cost member of the PIC18F88X family yet, Microchip Technologies' new PIC16F882 provides design engineers with a lower-cost migration option, it says. The PIC16F882, along with ...
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Electrocomp enters into cooperation agreement with European component distributor
21 February 2007, News

Rutronik Elektronische Bauelemente has over 30 years' success in the dynamic growth market of active, passive and electromechanical components
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The thermal challenges presented by small packages
21 February 2007, Altron Arrow, Future Electronics, Tempe Technologies, Power Electronics / Power Management

As IC packages get smaller and smaller, new thermal management problems arise. Although these new devices often dissipate the same, or even more power than earlier generations, it is much more difficult ...
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Class G amplifier technology enables piezoelectric drive with only a few support components
21 February 2007, CST Electronics, Power Electronics / Power Management

One of the main attractions for using ceramic piezoelectric speakers is their thin form factor. But to maintain the advantage of the ceramic speaker, the amplifier must also provide a compact solution. ...
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Inductor model libraries extended
21 February 2007, Passive Components

Epcos has extended its model libraries for single and dual chokes, offering new model libraries for power inductors at no cost. Components that have undergone recent changes as well as new products have ...
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ESD/EMI modules for SIM card readers
21 February 2007, Interconnection

Epcos has developed a new EMI/ESD module that can be integrated directly into SIM card readers. It permits significant space-saving compared to discrete solutions. Four Pi filters and four varistors are ...
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Surface mount bridge rectifier is a powerful device
21 February 2007, Power Electronics / Power Management

Diotec's new SMD bridge series, the B40S2A to B380S2A, offers output currents of up to 2,3 A in SO-DIL package. This makes them, according to the manufacturer, the most powerful SMD bridge rectifiers ...
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