iCorp Technologies

Tel: +27 11 781 2029
Email: [email protected]
www: www.icorptechnologies.co.za
more information about iCorp Technologies

Battery-friendly Thread and BLE solution
28 April 2026, DSP, Micros & Memory

Positioned as an incremental upgrade to the ESP32-H2, Espressif’s ESP32-H21 adds an integrated DC-DC converter that reduces active current draw and helps extend battery life in power-sensitive consumer and industrial devices.
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DC-DC converters for next-generation IoT
28 April 2026, Power Electronics / Power Management

AIPUPOWER’s K78XXJT-500R3 and K78XXJT-500R3-LB give designers a compact, high-efficiency power option for battery-powered and space-constrained systems, combining up to 96% efficiency with no-load input current as low as 0,2 mA.
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Compact edge platform for AI
28 April 2026, AI & ML

Built around the Qualcomm QCS6490 octa-core SoC, Quectel’s QuecPi Alpha delivers up to 12 TOPS of on-device AI performance.
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Low-power SoC for IoT designs
28 April 2026, DSP, Micros & Memory

Espressif’s ESP32-H4 is a dual-core 32-bit RISC-V SoC designed for battery-powered wireless products that require low energy consumption, strong security, and modern connectivity.
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NVDC power-path control to 1– 6 cell battery systems
28 February 2026, Power Electronics / Power Management

SG Micro’s SGM41581 is an I2C-controlled narrow voltage direct charging buck boost charge controller designed to simplify robust power delivery in systems that must seamlessly operate from an adapter input or a battery pack.
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iCorp brings BeeLee’s compact switch and sensor components to local designers
30 March 2026, Switches, Relays & Keypads

BeeLee’s product catalogue includes (among others) vibration sensors, tilt ball switches, reed switches, hall sensors, optocoupler (photo interrupter) devices, and liquid level switches.
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Wi-Fi 7 tri-band connectivity module
30 March 2026, Telecoms, Datacoms, Wireless, IoT

Quectel has introduced the FCE870Q, a compact short range wireless connectivity module designed for next generation IoT devices that require high throughput, low latency, and reliable operation in dense wireless environments.
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Lower-power Thread and BLE connectivity
30 March 2026, DSP, Micros & Memory

Espressif has released the ESP32-H21, a low-power wireless SoC aimed at Thread, Matter, Zigbee, and Bluetooth LE device designs.
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Enabling the next generation of high-performance wireless designs
30 March 2026, Telecoms, Datacoms, Wireless, IoT

Espressif Systems has expanded its wireless connectivity portfolio with the introduction of the ESP32-E22, a high-performance connectivity co-processor designed for next generation embedded and IoT systems.
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Tiny power inductor for low noise applications
28 February 2025, Passive Components

With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.
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Next-gen Wi Fi 6E connectivity for embedded systems
28 February 2026, Telecoms, Datacoms, Wireless, IoT

Espressif Systems has expanded its connectivity portfolio with the introduction of the ESP32-E22, the company’s first Wi-Fi 6E connectivity co-processor.
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Rugged railway-grade DC-DC power modules
28 February 2026, Power Electronics / Power Management

iCorp Technologies has introduced the AIPUPOWER ZCD100 and ZCD150 Series, a family of rugged DC-DC converters designed to meet the demanding electrical and environmental requirements of railway and transportation systems.
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