Horizontal SMT headers and sockets
18 July 2018, Interconnection

Mill-Max Mfg. has developed a line of horizontal SMT (HSMT) headers and sockets ideally suited for low-profile parallel board-to-board or board-to-component mating. The removable plastic cap provides ...

Solder cup headers and sockets
16 May 2018, Interconnection

Mill-Max has produced new 1,27 mm pitch solder cup headers and sockets for termination of fine-gauge wires and cables. These solder cup connectors are ideal for applications that demand a highly reliable ...

Low-profile interconnect sockets
18 April 2018, Interconnection

Many of today’s products, such as implantable and wearable devices for the medical industry, demand miniaturisation along with high functionality and reliability. Those requirements drive designers ...

PCB pins for plated through-holes
19 April 2017, Interconnection

Mill-Max has added to its diverse mix of press-fit pins for plated through-holes with six new offerings designed for applications where mechanical strength and/or power delivery are essential. These new ...

Rugged optical module
20 April 2016, Interconnection

Samtec and Amphenol Aerospace have teamed up to address the growing need for embedded optics in rugged environments. Samtec is releasing an extended temperature embedded optical module utilising the ...

DIL spring loaded connectors
24 February 2016, Interconnection

A range of dual in-line, spring loaded contact connectors is available from Cambion, in 4 through 20 ways. With low-resistance contacts (20 m maximum) spaced at 2,50 mm, the connectors can be used for ...

Right angle socket array
27 January 2016, Interconnection

Samtec’s new right angle SEARAY 0,80 mm pitch socket array is ideal for micro backplane applications with up to 50% board space savings compared to their 1,27 mm pitch counterparts. The open pin field ...

Press fit socket arrays
25 November 2015, Interconnection

Samtec’s family of SEARAY open pin field arrays has expanded to include a right angle socket with press fit terminations for increased design flexibility and high retention. This socket is a high-density ...

Discrete wire interconnects
25 November 2015, Interconnection

Samtec’s 1,00 mm pitch discrete wire system is now available in a double-row design (S1SD/S1SDT series) for increased flexibility and single-row with rugged latching (S1SS/S1SST series) ideal for ...

High-density array cable assemblies
4 November 2015, Interconnection

Samtec’s SEARAY 0,80 mm pitch, ultra high-density array cable assemblies provide 50% board space savings compared to 1,27 mm pitch SEARAY systems. With performance to 15 Gbps and up to 300 total Edge ...

High-speed elevated arrays
2 September 2015, Interconnection

Samtec’s newly released SkyRay elevated array system offers design flexibility and high-speed performance without sacrificing signal integrity. The system supports 28+ Gbps applications, as well as PCIe ...

High-density interposers
1 July 2015, Interconnection

Samtec has added 1,00 mm pitch arrays (ZA1 Series) to its Z-Ray product line, offering a choice between dual compression contacts or single compression with solder balls. These one piece arrays are ultra-low ...