Manufacturing / Production Technology, Hardware & Services


New Fuji stencil printer supports larger panels

20 February 2013 Manufacturing / Production Technology, Hardware & Services

Fuji has released the NXTP M35 stencil printer, which expands the supported panel size of this printer series to 350 x 300 mm.

The latest addition to the lineup has all the features of the previously released NXTP M25, but with a wider body for handling medium sized panels.

Available in both single and double conveyor specifications, the machine offers enhanced performance for the production of automotive and tablet panels. Fuji has used its manufacturing experience and robot technology to ensure that this printer achieves high real throughput while maintaining excellent print accuracy.

High speed production is not just about the printing operation, changeover work is also a vital factor. The conveyor arrangement and one-sided operation of the NXTP series means that changeover work for one lane can be performed without interrupting production at the other lane. Also, with job changeover possible simply by scanning a barcode, getting ready for the next production job is simplified.

Features that ensure print quality high enough for the latest manufacturing demands include vacuum for holding down the stencil during printing and snap-off, an easily adjustable squeegee angle, a low-impact clamping mechanism, and solder roll control to prevent air bubbles. Alignment accuracy is ±10 μm, which is suitable for the production of parts as small as 0402 mm.

Various line configurations are possible with the NXTP. As well as a single printer line, printers can be arranged next to each other or even back-to-back in combination with Fuji’s All-in-one AIMEX IIS mounter to create a dual-lane line capable of independent production in each lane.

The NXTP series features a touch-screen operation panel which makes setup and operation easy. Jobs and settings can also be specified in the same Fuji Flexa software that is used to manage other Fuji machines. Furthermore, there is a function for verifying that the correct materials are being used at the machine, as well as an automatic solder supply unit and cleaning mechanism that delivers cleaning agent to the necessary area only.



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