Manufacturing / Production Technology, Hardware & Services


Latest Articles

High-strength thermal adhesive
23 October 2013
Bergquist has introduced Liqui-Bond SA 3505 high thermal conductivity adhesive, which helps save the costs and time associated with clip or screw fastening of heatsinks in power supplies and discrete ...

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Banding tool system
18 September 2013, Connector & Wire Services
Daniels Manufacturing Corporation’s one-step band application tools are built to M81306/1 specifications and are designed to apply M85049/128-03, M85049/128-04, M85049/128-07 and M85049/128-08 bands. ...

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Component mounter
7 August 2013, Testerion
Fuji Machine Manufacturing announced the release of its new NXT III mounting platform, the latest iteration of the NXT series providing better productivity for all part sizes and types thanks to a faster ...

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Solder recovery system
7 August 2013, Truth Electronic Manufacturing
EVS International’s new-generation EVS 1000 solder recovery system features all of the recovery performance of the company’s standard and lead-free solder units, but in a smaller size and footprint that ...

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Heatsink attachment system
7 August 2013
Advanced Thermal Solutions has added to its line of maxiGRIP attachment systems for fast, secure mounting of heatsinks to flip chips, BGAs and other hot PCB components. More than 200 variations of maxiGRIP ...

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Water-soluble solder wire
7 August 2013, Electrocomp
Balver Zinn’s LF3237 solder wire features a high activated water-soluble flux formulation for special applications. It shows excellent soldering and wetting performance even on difficult surfaces. Due ...

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Interactive squeegee blade selection guide
7 August 2013
Photo Stencil, a full-service provider of high-performance stencils and tooling, has introduced its new Interactive Squeegee Blade Selection Guide. Accessible via www.photostencil.com, it provides characteristics ...

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Selective soldering cell
7 August 2013, ZETECH ONE
The Vitronics Soltec 6746 is a selective soldering automation work cell that delivers high throughput and flexibility while minimising its footprint in the factory. Inline processes and intuitive programming ...

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Thermal transfer label printer
7 August 2013
The K-Sun PEARLabel 360 printer with MaxiLabel Pro version 4.0 labelling software is Windows 7 and Mac compatible. It is a new 360 dpi, wide format, heat shrink tube, wire wrap and general industrial ...

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High-frequency laminate material
7 August 2013, RF Design
Rogers Corporation has launched new RO4360G2 high-frequency laminate material with improved thermal reliability that will help fabricators achieve higher UL MOTs (thermal ageing performance). With a high ...

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Choosing the right laminates for your printed circuit board
7 August 2013, ICAPE TRAX / ICAPE South Africa
Often when doing my rounds visiting customers I am asked to recommend a PCB laminate for a particular design or application. Most often it would seem that the most important consideration for customers ...

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High-capacity SMD storage tower
7 August 2013, MyKay Tronics
At the recent APEX 2013 exhibition, MYDATA unveiled new models of its popular SMD Tower for compact storage of electronics manufacturing components. The new models will allow manufacturers to increase ...

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In-line AOI machine
7 August 2013, Techmet
Mirtec premiered its new MV-9 AOI systems at NEPCON China earlier this year. The MV-9 2D/3D CoaXPress in-line AOI systems are configured with the company’s Omni-vision 3D inspection technology that combines ...

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Board support system for Juki equipment
7 August 2013, Allan McKinnon & Associates
Production Solutions, manufacturer of the RED-E-SET board support system, announced a new supplier relationship with Juki Automation Systems in terms of which Juki will offer the RED-E-SET systems on ...

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Benchtop SPI machine
7 August 2013
ASC International’s VisionPro M500 SPI (solder paste inspection) system incorporates an advanced, rapid 3D inspection technology coupled with an intuitive Windows XP Pro/Windows 7 OS and packaged in a ...

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Considerations to reduce the cost of reworking micro array components
7 August 2013, Test & Rework Solutions
Micro ball grid array packages (µBGA) are rapidly becoming the package of choice when designing new printed circuit board (PCB) assemblies. These packages generally offer high, first-pass process yields ...

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Carbide metal side cutters
24 July 2013, Garry Lumpe Imports
Knipex has released an electronics side cutter with a carbide metal cutting edge capable of cutting tough materials like piano, nickel, tungsten and diode wire used in electronics and aerospace industries. ...

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Handheld crimping tool
12 June 2013, Otto Online
Samtec’s new CAT-HT-309-2830-12 hand tool is specifically designed to crimp the 1,00 mm CC09R series reeled contacts on #28 or #30 AWG wire. It is ideal for low-volume, pre-production and repair applications ...

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Thermal printer for self-service kiosks
12 June 2013, Custom Printers SA
Custom Printers’ third generation VKP80III self-service thermal printers are compact, sturdy and economical, both in installation and maintenance, and are backed by 20 years of experience in the kiosk, ...

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DDZ expands premises to boost capacity
15 May 2013
DDZ Technologies has introduced a dedicated automated PCB assembly line capable of handling larger quantities of boards, thanks to a pick-and-place machine and reflow system for surface-mount boards and ...

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