11 May 2011Manufacturing / Production Technology, Hardware & Services
Test Research Inc. (TRI) provides test systems for each phase of the manufacturing process, including solder paste inspection, automated optical inspection (AOI), automated X-ray inspection (AXI) and in-circuit testing (ICT).
At the beginning of the electronics manufacturing process is solder paste inspection (SPI). The TR7007 is a 64-bit, 3D SPI system for mid- to high-volume manufacturing, boasting inspection speed of 171 cm²/sec at 14 micrometres resolution and 87 cm²/sec at 10 micrometres. In addition, the machine implements ‘fringe pattern’ technology and a dual lighting system that eliminates shadows. It also uses a linear motor for smoother, more accurate imaging. The entry-level TR7006 features inspection speed of 76 cm²/sec at 20 μm resolution.
X-ray inspection technology can see through PCBs and hard-to-inspect components to check their connections to the PCB. TRI’s TR7600 is an AXI test system that provides in-line inspection for high-density components such as flip chips and BGAs, and micro-components down to 0201 and 01005. The system uses X-ray penetration to capture images using nine CCDs at different angles. Software developed in-house by TRI analyses the slice images and calculates the different slice heights to inspect for PCB defects.
TRI’s test systems have already been installed successfully in South Africa, such as this AOI machine at Vektronix
Optical inspection can take place pre- or post-reflow, inline or at a standalone station. TRI’s inline AOI solutions include the TR7700, which features a large-format digital 3CCD full-colour camera and can scan up to 130 cm²/sec@18 μm, and the TR7500, which combines a top-view digital 3CCD full-colour camera plus four angle cameras to provide complete AOI coverage. The standalone TR7530DT desktop system comes with a high-end digital 3CCD full-colour camera for clear capture of board images and is equipped with an ultra-low angle, coaxial RGB LED lighting system for efficient off-line defect detection.
After a board has been fully assembled, it needs to be fully tested. The TR5001 and TR8100LV are the latest models in TRI’s ICT product line, with well over 1200 systems deployed worldwide. The TR8100LV is a full-featured model for large, complex PCBAs, while the TR5001 is a cost-effective analog/digital tester with a variety of upgrade options from MDA to onboard programming and boundary scan.
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