Telecoms, Datacoms, Wireless, IoT


Quectel adds to its portfolio

31 October 2024 Telecoms, Datacoms, Wireless, IoT


Quectel Wireless Solutions has added three new short-range modules to its portfolio. The modules are the FC30R, a cost-effective, industrial-grade Wi-Fi module; the FCU743R, featuring Wi-Fi 4 and Bluetooth 5.2 capabilities; and the FCM740D, an MCU with Wi-Fi 4 and Bluetooth 5.2.

The FC30R is an ultra-compact, cost-effective industrial-grade Wi-Fi module that supports IEEE 802.11 b/g/n standards. Measuring just 12,0 x 12,0 x 2,1 mm, it is perfect for size-sensitive applications. It can be seamlessly integrated with Quectel 5G modules (RT620T series), 4G modules (EG25 series, AG35 series, EG95 series, EC21 series, EC25 series, EC20 series, EC200A series, EC200R series, EC300R-LA series), and other application processors from companies like NXP, ST, TI, and Ambarella, making it suitable for a wide range of M2M applications including EV chargers, mobile hotspots, on-board diagnostics (OBD), gateways and industrial PDAs.


The FCU743R is a USB interface, high-performance Wi-Fi 4 and Bluetooth 5.2 module that supports the 2,4 and 5 GHz Wi-Fi bands. The module can realise high-speed, low-power WLAN wireless transmission with a maximum data transmission rate of up to 150 Mbps. With an ultra-compact size of 13,0 x 12,2 x 2,0 mm, the module is ideal for size-sensitive applications.

Surface-mount technology makes FCU743R an ideal solution for durable and rugged designs, and the low profile and small size of LCC package ensure that it can be easily embedded into size-constrained applications and provide reliable connectivity with these applications.

The FCM740D is an MCU Wi-Fi 4 and Bluetooth 5.2 module, that boasts a high-performance processor with a frequency of up to 120 MHz, and supports IEEE 802.11b/g/n protocol and BLE 5.2. The module features built-in 256 kB SRAM and optional 2/4 MB flash. The module complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards. The FCM740D has an LCC + DIP form factor with an ultra-compact size of 20,3 x 15,8 x 2,7 mm, which optimises the size and cost for customers.


With a variety of low-power modes and long connection keep-alive mechanisms, the module is perfect for smart home, industrial IoT, consumer electronics and other applications, especially home appliances, small-sized smart lighting and other applications, and IoT devices with high-temperature requirements, such as HVAC, dimmer, light strips, smart sockets.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Macom targets broadband radar with time delay MMIC
RFiber Solutions Telecoms, Datacoms, Wireless, IoT
Macom’s MADU FR1012 is a GaAs MMIC 1-bit true time delay device covering 4 GHz to 12 GHz, designed for broadband microwave systems where beam accuracy and signal integrity are critical.

Read more...
Compact analogue phase shifter
RF Design Telecoms, Datacoms, Wireless, IoT
The Mini-Circuits JSPHS-150+ is a compact analogue voltage-controlled phase shifter designed for narrowband RF applications between 100 and 150 MHz.

Read more...
Wireless connectivity expanded
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.

Read more...
Integrated X-band radar front-end module
RF Design Telecoms, Datacoms, Wireless, IoT
Qorvo has introduced an X-band radar front-end solution that enables defence system designers to achieve higher performance without increasing size, weight or prime power.

Read more...
Introducing Aurata
CST Electronics Telecoms, Datacoms, Wireless, IoT
Antenova has launched Aurata SR4L112: a compact, high efficiency embedded 4G/LTE antenna engineered for long, narrow PCB designs.

Read more...
Multi-constellation GNSS module in a legacy-compatible footprint
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.

Read more...
Quectel expands 5G portfolio
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.

Read more...
Compact RTK design: More than just the receiver
iCorp Technologies Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.

Read more...
Microchip advances Space-Grade timing performance
ASIC Design Services Telecoms, Datacoms, Wireless, IoT
Microchip Technology has expanded its atomic clock portfolio with the radiation-tolerant Space CSAC-SA65, a Chip Scale Atomic Clock designed to deliver precise timing for space systems.

Read more...
Channel emulator for 6 G and Wi-Fi 7/8
Concilium Technologies Telecoms, Datacoms, Wireless, IoT
With 400 MHz instantaneous bandwidth and support for carrier frequencies up to 23,6 GHz, Vertex 6.0 is the industry’s first channel emulator designed for next generation 6 G and Wi-Fi 7/8 testing.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved