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Schroff: Electronic Packaging
18 October 2006, Technical Literature

Schroff's new product range is presented in its latest 800 pg Electronic Packaging catalogue. Entire product spectrum of cabinets, cases and subracks, stretching to backplanes, power supplies and climate ...
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Modular jacks with integrated magnetics have extended operating temperature
4 October 2006, Interconnection

Many industrial designs require an extended operating temperature range, and for such demanding applications Erni provides modular jacks that operate from -40 to 85°C. Modular jack connectors have been ...
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Schroff: Electronic Packaging
4 October 2006, Technical Literature

Schroff's new product range is presented in its latest 800 pg Electronic Packaging catalogue. Entire product spectrum of cabinets, cases and subracks, stretching to backplanes, power supplies and climate ...
read more


Audio technology housed in leading-edge subracks for 2006 FIFA World Cup
20 September 2006, Enclosures, Racks, Cabinets & Panel Products

Lawo, a leading supplier of professional audio technology in radio and television, received the order to take over the audio transmission from all 12 World Cup stadia to the International Broadcast Centre...
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6U development system for hardware and software
20 September 2006, Enclosures, Racks, Cabinets & Panel Products

For system integrators as well as hardware and software developers, Schroff has configured a specific 6U MicroTCA system for the development and testing of applications in their original environment. ...
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2U subrack for MicroTCA a first
20 September 2006, Enclosures, Racks, Cabinets & Panel Products

MicroTCA is a modular standard with the aim to assemble AdvancedMC modules without a carrier board directly into a backplane. As special mechanical units for the various modules, in half height (HH) and ...
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More than simply 'electronic packaging'
20 September 2006, Enclosures, Racks, Cabinets & Panel Products

At Schroff, ‘electronic packaging’ means more than just 19” plug-in units and subracks. It means the integration of electro-mechanical and electronic components, such as backplanes, power supplies, switches ...
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Schroff: Electronic Packaging
20 September 2006, Technical Literature

Schroff's new product range is presented in its latest 800pg Electronic Packaging catalogue. Entire product spectrum of cabinets, cases and subracks, stretching to backplanes, power supplies and climate ...
read more


Robust MicroTCA Ecosystem being created
6 September 2006, Computer/Embedded Technology

Although the MicroTCA base specification has yet to be ratified, many telecom equipment manufacturers are eager to begin utilising the benefits of ATCA's high performance and management capabilities in ...
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Ultra-flat board-to-board connector
23 August 2006, Interconnection

MPE-Garry's board-to-board connector family enables the stacking of PCBs in sandwich form with a distance of only 1,5 mm. They are available with pole numbers from 10-30, pitch 0,50 mm. Contacts are ...
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Erni DIN Portfolio
23 August 2006, Technical Literature

Erni has compiled a catalogue for its comprehensive portfolio of DIN 41612/IEC 606032 connectors for diverse applications. In more than 200 pages, Erni presents its extensive offering of connector products ...
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Terminal strips with crimp-snap contacts
9 August 2006, Interconnection

MPE-Garry's male and female terminal strips in accordance with DIN 41 622, are used in communications, engineering and machine building, especially in high voltage applications. The carrying capacity ...
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