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Next-generation energy measurement solution launched
7 March 2007, Electrocomp, Future Electronics, Tempe Technologies, Analogue, Mixed Signal, LSI

Microchip's new MCP3909 energy-measurement IC combines low power consumption with an SPI interface and active power pulse output. As a part of the MCP3909 3-Phase Energy Meter Reference Design, the IC ...
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Need another supply other than VDD? With a CCP, it is as easy as ABC
7 March 2007, Electrocomp, Tempe Technologies, Future Electronics, Power Electronics / Power Management

In many applications, the power supply voltage is often dictated by an external design constraint such as battery voltage, bus-powered USB or something as mundane as a single-output, low-cost wall wart. ...
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MAPS simplifies device selection for electronic designs
7 March 2007, Electrocomp, Future Electronics, Tempe Technologies, News

The new Microchip Technologies' Advanced Product Selector (MAPS) Version 2.0 has debuted online, providing a comprehensive selection tool for the chip company's complete product portfolio including analog, ...
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Wide range of new frequency control products launched at electronica
7 March 2007, Electronics Technology

Frequency control specialist, Euroquartz, launched a wide range of new products at the electronica 2006 trade show in Germany. Euroquartz unveiled a new range of dielectric microwave products, a new ...
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High-speed connector now has more features
7 March 2007, Interconnection, AI & Data Analytics

Samtec’s Q2 second-generation high-speed connector system (QMS/QFS Series) options have been expanded with integrated power pins (PC Option), RF connectors (RF option), and retention pins (RT option) ...
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General-purpose small PIC microcontroller
7 March 2007, Electrocomp, Future Electronics, Tempe Technologies, DSP, Micros & Memory

Claimed to be the lowest-cost member of the PIC18F88X family yet, Microchip Technologies' new PIC16F882 provides design engineers with a lower-cost migration option, it says. The PIC16F882, along with ...
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Low-power USB 2.0 hub controller
21 February 2007, Telecoms, Datacoms, Wireless, IoT

Cypress has introduced its next generation of high-speed USB 2.0 hub controllers. The EZ-USB HX2LP controller is optimised for cost-sensitive applications including standalone hubs, monitors, docking ...
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The thermal challenges presented by small packages
21 February 2007, Electrocomp, Future Electronics, Tempe Technologies, Power Electronics / Power Management

As IC packages get smaller and smaller, new thermal management problems arise. Although these new devices often dissipate the same, or even more power than earlier generations, it is much more difficult ...
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Lighting applications can benefit from high-efficiency power MOSFET
21 February 2007, Power Electronics / Power Management

STMicroelectronics has developed a new power MOSFET family. The first member allows customers to drastically reduce conduction losses and increase efficiency and reliability of their lighting applications ...
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New devices help protect DC power ports and downstream electronics
21 February 2007, Circuit & System Protection

Raychem Circuit Protection has introduced its PolyZen polymer enhanced, precision Zener diode micro-assembly. Designed to meet the growing need for overcurrent and overvoltage protection on portable equipment ...
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Retention pin options for high speed connectors
21 February 2007, Interconnection

Samtec's Q2 second generation high speed connector system (QMS/QFS Series) features have been expanded with a standard retention pin option (RT1) that can as much as double the un-mating forces in typical ...
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Triple-axis acceleration sensors in smaller package
21 February 2007, EBV Electrolink, Electronics Technology

Freescale has introduced three highly sensitive XYZ-axis MEMS-based accelerometers. Designers of portable electronics devices have to focus on ways to make portable devices more reliable and robust by ...
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