Electronic Industry Supplies

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more information about Electronic Industry Supplies

Sealed USB connectors
16 March 2011, Interconnection

CONEC recently expanded its bayonet locking and water-resistant series of connectors with a USB connector compliant with USB2.0 specifications. This connector is part of CONEC’s expansive IP67-rated ...
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Radome antenna assemblies
19 January 2011, Telecoms, Datacoms, Wireless, IoT

Spectrum has developed high-performance radome antenna assemblies designed for plug-and-play use in ISM, satellite and WiFi applications. The AR series antenna assemblies feature a patch antenna mounted ...
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Vapour phase thermal profiling kit
24 November 2010, Test & Measurement

ECD has released the PTP VP-8 thermal profiling kit for vapour phase soldering. As boards become more complex, with a range of high- and low-mass and lead-free passive and active components, vapour phase ...
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EMI-filtered Micro-D-Sub connectors
10 November 2010, Interconnection

A line of small, lightweight EMI-filtered Micro D-Subminiature connectors was introduced by Spectrum’s Advanced Specialty Products division. They feature the same high performance EMI filtering and rugged ...
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RF test probe integrates attenuator
10 November 2010, Test & Measurement

INGUN has developed what it claims is the first spring-loaded RF probe with an integrated attenuation module. It is designed for production-line test of RF applications, eg, telecommunication market in ...
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PCB marking units
13 October 2010, Manufacturing / Production Technology, Hardware & Services

New marking units from Ingun are used to mark ‘good’ tested printed circuit boards. They are powered by means of compressed air: an electrical impulse signal activates a free positional solenoid valve. ...
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Test probes for coaxial RF switches
13 October 2010, Test & Measurement

Ingun’s range of RF-Switch contacting probes can be used for a wide variety of applications where a transmission line has to be opened in order to prevent signal losses caused by impedance mismatch due ...
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Solder reflow oven
12 May 2010, Manufacturing / Production Technology, Hardware & Services

Mekko’s new Euroflow 300C solder reflow oven design includes a new heater control system designed to overcome the problem of varying temperatures across the substrate, encountered with lead-free soldering. ...
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PCB cleaner for low-standoff components
12 May 2010, Manufacturing / Production Technology, Hardware & Services

Zestron’s new VIGON A 201 is an MPC PCB cleaning agent that provides excellent cleaning performance in capillary spaces. Therefore flux residues even under low-standoff components, such as micro BGAs, ...
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EMI-filtered Micro D-Sub connectors
17 March 2010, Interconnection

A new line of small, lightweight EMI-filtered Micro D-Subminiature connectors has been introduced by Spectrum’s Advanced Specialty Products division. They feature the same high performance EMI filtering ...
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Test fixture provides high contact force
17 March 2010, Test & Measurement

The MA 2112 from Ingun is an evolutionary development of the successful MA 2110, incorporating advances in contact force, intermediate interface and ergonomics. The contact force of the new test fixture ...
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Self-cleaning test probe tips
3 March 2010, Test & Measurement

Ingun has developed a new test probe tip style with an innovative self-cleaning function for longer term contacting reliability and lifecycle. The tip style 79 (star) has a number of self-cleaning, ...
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