Fibocom’s H350 LGA module adopts an advanced Intel platform and supports GSM/GPRS/EDGE and UMTS/HSDPA/HSUPA/HSPA+. Its rich application interface includes USB 2.0, UART, I2C, I2S and SPI, and a built-in ...
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The new Mega-Fit power connector line from Molex is a wire-to-board system delivering 23 A in a small 5,70 mm footprint. It is ideal for applications requiring power from 14 to 23 A per terminal across ...
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LUMAWISE LED holders from TE Connectivity are engineered to ensure optimal LED placement by integrating electrical, mechanical, thermal and optical connectivity. The products are designed for common ...
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TDK has extended its BR7000 series of EPCOS power factor controllers with two new types: the BR7000-I-TH offers 12 relay outputs for capacitor contactors and 12 transistor outputs for thyristor modules; ...
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In July this year, TDK will commence mass production of a new series of soft-termination MLCCs that are specially designed to withstand flex cracking caused by bending stresses to a printed circuit board. ...
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Sensirion’s SHTC1, sized at just 2 x 2 x 0,75 mm, measures not only humidity but also temperature – across ranges and to accuracy levels of 0% to 100% RH (±3%) and -30°C to +100°C (±0,3°C) respectively. ...
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TDK’s new EPCOS TSM-LC-S thyristor module for dynamic power factor correction (PFC) is designed for voltages of 200 V to 440 V a.c. (50/60 Hz) and is suitable for compensating reactive power up to 55 ...
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TDK has developed a new multilayer diplexer in case size IEC 1005 for the implementation of 2,4 GHz/5 GHz band WLAN in smartphones and other mobile devices. With its miniature dimensions of 1,0 x 0,5 ...
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Design engineers are well aware that providing ESD (electrostatic discharge) protection according to the IEC’s 61000-4-2 standard can fall short when guarding against the more severe damage caused by ...
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The new C928 type MEMS microphone from TDK is distinguished by its particularly high signal-to-noise ratio (SNR) of 66 dB(A) in the frequency range between 20 Hz and 20 kHz. It is thus particularly well ...
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FTDI Chip has expanded its Embedded Video Engine (EVE) offering with the introduction of the FT801, which supports intelligent display implementations with capacitive touch screens. The new device possesses ...
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Molex announces its new Lite-Trap SMT wire-to-board connector system featuring an overall compact size that meets the needs of thin LED lighting module applications. With a profile height of just 4,20 ...
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