Quectel has recently announced its LG580P, a multi-constellation, multi-band GNSS module designed for high-precision positioning that supports multi-band signals across L1, L2, L5, and L6.
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Espressif’s ESP32-C6 is the world’s first RISC-V MCU to achieve PSA-L2 security certification, security certification, underscoring the company’s commitment to delivering robust, secure, and reliable IoT solutions.
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he HTF-MP series is more suitable for complex multiphase power supply applications in design, effectively meeting the needs of ultra-thin and high-power devices.
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The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.
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Quectel has introduced the SG882G, its latest flagship Android/Linux smart module, designed to deliver exceptional computing power, multimedia capabilities, and seamless connectivity for industrial and consumer applications.
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Quectel Wireless Solutions recently announced the launch of its 5G transparent antenna, the YFCX001WWAH, an innovative solution designed to improve connectivity while maintaining seamless device design.
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The EG810M series is a series of LTE Cat 1 bis wireless communication modules specially designed by Quectel for M2M and IoT applications.
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Powered by a Qualcomm processor, Quectel’s new SC200V is designed to deliver exceptional performance across system capabilities, multimedia functions, and network connectivity.
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The SGM621B is a high accuracy, high voltage instrumentation amplifier, which is designed to set any gain from 1 to 10 000 with one external resistor.
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The EG810M series is a series of LTE Cat 1 bis wireless communication modules specially designed by Quectel for M2M and IoT applications.
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With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.
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The increased demand for computing power in data centres has resulted in the development of multi-phase ultra-low profile, ultra-high current copper magnetic co-fired power inductors.
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