Selective soldering system handles mixed assembly boards in-line 4 June 2003, ZETECH ONE Most of today's PC boards present a co-existence of through-hole and surface mount packages on the same board (mixed assembly). Whenever a board's secondary side contains devices that cannot go through ...
Round electronics cases 4 June 2003 OKW's new family of plastic electronics cases called Art-Case, has a unique, rounded design concept, and is targeted at indoor electrical and electronic applications, where particular importance is attached ...
Next-generation ProASICPLUS programmer is portable 21 May 2003, ASIC Design Services Actel is offering its portable, low-cost FlashPro Lite programmer for use with the company's flash-based ProASICPLUS family of FPGAs. Actel says the next-generation programmer has been size-optimised ...
Precision sheet metal fabrication 21 May 2003, Denver Technical Products Due to the high level of skill of its artisans, Denver Technical Products says it is now in a position to offer high quality production of complex sheet metal fabrications in mild steel, stainless steel ...
Larger ergonomically-shaped 'bodycases' 21 May 2003 OKW's recently introduced ERGO-CASE series has now been supplemented by a larger version. The series of cases can either be used as 'bodycases' for carrying on the body, or universally, as handheld, desktop ...
Automated offline inspection of solder joints 7 May 2003, ZETECH ONE , News & Events The applications for BGA, FBGA, CSP and FlipChip interconnection techniques are expanding into broader fields of application. Since these substrate-based solder joints are scarcely accessible to other ...
Basic probe fixturing for board testing 7 May 2003, Products & Solutions Spring contact probes are used as the interconnection medium between the unit under test (UUT) and the tester. This article gives a general discussion of probe fixturing, limited to the most common types ...
Universal enclosures for industrial applications 7 May 2003, Actum Electronics Especially developed for use in applications that fall between single card enclosures and 19" racks, Erni's LDG-D housings are available in three sizes - 6, 10 or 20 connections. These enclosures are ...
Housings with plug-in connection 7 May 2003, Actum Electronics, Products & Solutions Erni's LDG-A miniature housings with frame insert and receptacle for a separate multipoint connector are now available in A16, A30 and A46 versions. Depending on assembly they offer maximum component ...
Control enclosure for building automation 7 May 2003 Bopla's Bovista enclosure system is designed especially for use in building automation systems. However, the wide range of ways of combining lids and bases ensures that this plastic enclosure can also ...
512 Kb serial EEPROM in low-profile DFN package 23 April 2003, Tempe Technologies Microchip says that its new 512 Kb I2C compatible serial EEPROMs are the first to be available in an 8-pad dual flat no-lead package. The 6 x 5 x 0,9 mm DFN packages are ideal for low-headroom applications, ...
'Easy-to-use' starter kit to explore reprogrammable FPGA devices 23 April 2003, ASIC Design Services Actel released a low-cost starter kit for its cost-competitive flash-based, reprogrammable ProASICPLUS field-programmable gate array (FPGA) devices. The ProASICPLUS Starter Kit is a complete package consisting ...
Via filling process improved 23 April 2003, ZETECH ONE Developed in response to customer requirements, DEK has announced that its new Via Fill process delivers 100% fill of substrate vias with no voids and minimal surface residue. The technique uses DEK's ...
Flow monitoring 9 April 2003, ZETECH ONE PVA's inline flow monitoring systems allow precise data feedback on material quantities applied during each application cycle. This data can be displayed on the front panel LCD screen, downloaded to a ...
Programmable system-on-chip: the next level 26 March 2003, ASIC Design Services Programmable logic vendors have now introduced devices with performance that rivals ASIC designs, without the cost of a $1-million mask set, or minimum volume requirements. To achieve this high-performance ...
New platform redefines semi-automatic performance 26 March 2003, ZETECH ONE DEK claims it has raised the performance of semi-automatic screen printers, by introducing the Viking-class Horizon 05 platform featuring fully automatic vision alignment, the DEK adjustable stencil mount ...
Handheld case for a good grip 26 March 2003 The new Hand-Terminal M series of cases from OKW has been specially developed for rough conditions and for all areas requiring a particularly robust and waterproof handheld case. Designed as a three-piece ...
Silicone-free form-in-place gasketing material 12 March 2003 Laird Technologies' non-silicone based form-in-place gasketing compound (SNNSF) is ideal for critical applications where concerns over silicone migration or contamination exist, such as in the telecommunications ...
Optical inspection system sees the low-down 12 March 2003, Test & Rework Solutions Metcal's innovative VPI-1000 optical inspection system adds features and flexibility to traditional optical inspection while offering customers an economical inspection solution. According to the company, ...
