Manufacturing / Production Technology, Hardware & Services


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Compact, modular soldering machine has quick programming
20 September 2006, ZETECH ONE
Circuit manufacturers who need an in-line capable selective soldering machine, that is quick to set up and well suited to a high product mix environment will find Vitronics Soltec's compact, modular mySelective ...

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Lead-free no-clean solder paste offers a variety of benefits
20 September 2006, Allan McKinnon & Associates
Kester's Enviromark 918 (EM918) is a lead-free, halide-free, no-clean air or nitrogen, reflowable solder paste with probable residues and superior activity. According to the manufacturer, its clear residue, ...

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Silver conductive adhesive
20 September 2006, Electronic Industry Supplies
Heraeus' Circuit Materials Division has introduced newly-developed thermosetting, one-component, silver conductive adhesives. The new PC 3000-Series is solvent-free and its outstanding feature is an excellent ...

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Retaining springs to fit transistors to heatsinks
20 September 2006, Electrocomp
Facilitating the rapid and easy installation of semiconductor components, for example, transistors on heatsinks, reduces assembly costs considerably. For its existing range of heatsinks with special integral ...

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Printed board assemblies sag during lead-free wave soldering - but they do not have to with good design
6 September 2006
Today, the most common type of wave-soldering conveyor is the finger system. Although more expensive than the chain system, finger conveyors are more versatile as the conveyor may be opened and closed ...

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Climatic test chamber further improved
6 September 2006
Binder has improved its MKF series of climatic test chambers. The main advantage of this redesigned series, in addition to the technical improvements of its inherent features, is enhanced ergonomics and ...

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Reballing for reliable QFN rework
6 September 2006, ZETECH ONE
When electronic assemblies are reworked there should be no reduction in quality and reliability. This is why Martin has introduced new QFN Reballing Technology to allow desoldered and no longer useful ...

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SchmartBoard now for tiny discrete components
23 August 2006, KH Distributors
SchmartBoard, the developer of a technology that has simplified the creation of electronic circuits for hobbyists, students and electronic engineers, has released two new boards that address tiny discrete ...

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High-speed and performance chip feeder family
23 August 2006, ZETECH ONE
Universal has launched a family of feature-loaded spliceable tape feeders designed to boost the performance of high-speed chip placement equipment, while supporting line-level reporting and traceability ...

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'Dream Team' for QFNs shown at expo
9 August 2006, ZETECH ONE
Martin launched its 'Dream Team' for QFNs at the SMT 2006 show held in Nuremberg, Germany, recently. With its Rework-Dispenser and its Auto-Vision-Expert, the duo comprises an innovative machine pair ...

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Dissipative worksurface mats
9 August 2006, Actum
Altico Static Control Products offers a range of worksurface mats for electronics production in two stock sizes, on rolls or to customer requirements. The two-layer Economat rubber worksurface mat is ...

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Pocket printer to mark cables, wires and boards
9 August 2006
Grafoplast, a company that specialises in wire marking and identification products for the electrical and electronics industries, is offering a new pocket printer, the EGO4YOU. This battery-operated ...

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Breakthrough in ultra-thin leadless packaging
26 July 2006
Royal Philips Electronics has claimed a breakthrough in ultra-thin leadless packaging (UTLP) with two new packages for Logic and RF applications: MicroPakII and SOD882T. MicroPakII is the world's smallest ...

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Specifying, selecting and buying equipment
26 July 2006
SMT stencil printing may be a mature technology, but it is still the key to repeatable productivity and quality. To understand where the future of automatic stencil printing lies, it is helpful to review ...

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SMD technology now within anyone's reach
26 July 2006
A manual pick-and-place machine that is claimed to be easy to use, works fast, takes up limited space, and is affordable is being manufactured by Pretoria-based company Faze Electronics. The unit allows ...

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Soldering tips for the 'lead-free' process
26 July 2006, Allan McKinnon & Associates
Soldering is based on the ability of different metals to dissolve or diffuse into each other and to cause an electrical connection at lowest resistance and mechanical fixing. Flux is used to dissolve ...

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Static shielding bags for electronic boards and parts
26 July 2006, Actum
Static shielding bags have been designed for ESD safe packaging of PCBs and ICs. They protect their contents against ESD and electrostatic fields. Available from Altico Static Control Products the BBAS7200 ...

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Rust/corrosion preventer
26 July 2006, Altico Static Control Solutions
Rust damages and destroys valuable metallic products. Due to corrosion and the resultant damage, manufacturing companies are incurring huge annual losses. This is damage that can be prevented. According ...

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Case story: Microtronix' first lead-free production run
26 July 2006, Microtronix Manufacturing
'Lead-free' is finally upon us. Microtronix is starting to get enquiries on a daily basis as to our current lead-free capabilities so the time has clearly come for us to stop talking about it and actually ...

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Horizontal convection 'across the board'
26 July 2006, Test & Rework Solutions
Forced-air convection, being the preferred technology for solder reflowing surface mount assemblies, represents a shift from infrared (IR) and other methods for reasons solidly based on principles of ...

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