Infineon Technologies has developed the next generation of its Goldmos LDMOS (laterally diffused metal-oxide semiconductor) die technology for high-performance, high-power RF transistors. In addition ...
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Wales-based LCR Capacitors' full-colour 11 page shortform displays company's range of capacitors, chokes, filters and special products for use in power factor, snubber, interference suppression pulse ...
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Phoenix Passive Components' brochure centres on company's range of film capacitors which include: metallised polyester; interference supression; AC and pulse metallised polypropylene and AC and pulse ...
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The XT55 is said to be the first compact tri-band GSM/GPRS module equipped with a GPS receiver for satellite navigation. The combination of these two technologies allows seamless tracking of goods, vehicles, ...
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At the Sensors Conference & Expo, Infineon Technologies revealed three new sensor products for automotive safety applications. The new sensor products expand the company's portfolio in these automotive ...
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Fischer Elektronik is able to meet with customers' specifications that are not covered by its standard range of board interconnects. In its own toolmaking shop, forming tools for custom-specific insulating ...
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Infineon has extended its communications product portfolio with its Amazon ADSL2/2+ CPE and WildCard 802.11a/b/g WLAN solutions, intended for manufacturers to develop cost effective set-top boxes, DSL ...
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Bourns' new generation of chip diodes offers the capability to provide a silicon diode with minimal packaging overhead. The small signal diodes are lead-free with Cu/Ni/Au plated terminations and are ...
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From New Japan Radio comes its 2004 catalogue of products that includes technical information, specifications and diagrams. Includes: general purpose linear amplifiers; audio/video components; communication ...
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The large variety of electronic components and their high packaging density repeatedly requires new methods to ensure their cooling. Fischer Elektronik has developed a case system especially ...
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For dissipating heat from high-efficiency single electronic components on PC boards, the use of extruded heatsinks with special fastenings is a good solution. In addition to the well-known versions with ...
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Infineon Technologies claims its third generation integrated multichip power IC family provides the industry's lowest standby power consumption. The CoolSET F3 family exceeds specifications of such standards ...
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