| Tel: | +27 11 609 1244 |
| Email: | [email protected] |
| www: | www.zetech.co.za |
| more information about ZETECH ONE |
Microfocus X-ray inspection is a well established standard inspection method for hidden solder joints based on standard lead-tin alloys of area array packages such as BGA, CSP and Flip Chip. Due to increasing
read more
i-Pulse, a Yamaha Group company, was formed in March 2000. At that time, Tenryu Technics was acquired by the Yamaha Group, and i-Pulse was born as a result of this acquisition. Since taking over the company,
read more
Tombstoning of passive chip components during the mass reflow soldering process has plagued circuit assemblers since the beginning of production SMT assembly. 'Tombstoning' - the partial or complete lifting
read more
Universal Instruments' 4797L HSP turret-style chipshooter recently won two separate prestigious industry awards - both in the premium pick-and-place category.
The HSP secured top prize in the placement
read more
Kulicke & Soffa Industries (K&S), a leading supplier of semiconductor assembly and test interconnect equipment, has developed a new capillary that permits the use of thicker wires in fine pitch and ultra
read more
Zetech has announced that Circuits Assembly has awarded PVA the prestigious Service Excellence Award at the Apex Exhibition and Conference in California. This marks the third consecutive year that PVA
read more
PVA has introduced the PVA2000C lean manufacturing cell for selectively applying conformal coating materials.
This three-axis robot utilises atomised and non-atomised application processes to precisely
read more
Most of today's PC boards present a co-existence of through-hole and surface mount packages on the same board (mixed assembly). Whenever a board's secondary side contains devices that cannot go through
read more
The applications for BGA, FBGA, CSP and FlipChip interconnection techniques are expanding into broader fields of application. Since these substrate-based solder joints are scarcely accessible to other
read more
Developed in response to customer requirements, DEK has announced that its new Via Fill process delivers 100% fill of substrate vias with no voids and minimal surface residue. The technique uses DEK's
read more
PVA's inline flow monitoring systems allow precise data feedback on material quantities applied during each application cycle. This data can be displayed on the front panel LCD screen, downloaded to a
read more
DEK claims it has raised the performance of semi-automatic screen printers, by introducing the Viking-class Horizon 05 platform featuring fully automatic vision alignment, the DEK adjustable stencil mount
read more
© Technews Publishing (Pty) Ltd | All Rights Reserved