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STMicroelectronics has released what it describes as the industry's first IC with a complete set of configurable and customisable analog functions that represent a market-unique solution for printer,
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The new VCUT0714A-02Z BiAs (bidirectional asymmetrical), single-line ESD protection diode from Vishay offers extremely low capacitance in the very small SOD923 package. With a compact 0,6 mm x 1 mm footprint
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Microchip has released the MCP1603 - a 2 MHz, 500 mA switching regulator. This new, low-power switcher provides adjustable and fixed output voltages, operating efficiency of up to 90%, and is available
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This 51-page catalogue from Kemet covers its range of ceramic capacitors designed for high temperature and/or high voltage applications. Dimensions, electrical characteristics and ordering information/part
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Atmel Corporation has launched its ATF15xxBE family of RoHS-compliant, 1,8 V CPLDs with standby power consumption of just 5 micro-amps claimed to be over 60% less power drain than
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Lattice Semiconductor Corporation has released its LatticeECP2-50 and LatticeECP2-12 FPGA devices, produced on 90 nm Fujitsu CMOS technology utilising 300 mm wafers.
The devices employ a DDR2 SDRAM memory
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Texas Instruments has introduced a 24-bit audio codec that supports asynchronous operation, allowing the A/D converter and D/A converter to operate with independent clocks. The PCM3060 asynchronous audio
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Vishay Intertechnology has released a series of ultrabright white SMD LEDs that use high-efficiency InGaN technology to provide exceptional brightness in a compact 0603 footprint. At 1,6 x 0,8 x 0,6 mm,
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Successive approximation algorithm (CSA) is Cypress Semiconductor’s new capacitive sensing algorithm for its CY8C20x34 PSoC device family.
CSA enables the implementation of an array of capacitive sensors
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Microchip has expanded its linear product portfolio with the low power, high-precision MCP6031, MCP6032, MCP6033 and MCP6034 operational amplifiers.
The new devices have a quiescent current of only
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Samtec's EEDP Series High Data Rate Cable assembly provides a flexible high speed cable system for edge card interfaces with a choice of mounting and rugged latching options.
These assemblies use 30
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Samtec’s new HD Mezz elevated high density interconnects, the HDAM/HDAF Series, provide a solid grid of contacts on 1,2 mm x 2 mm pitch with up to 299 signals/grounds or 92 signal pairs.
These connectors
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