Manufacturing / Production Technology, Hardware & Services


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Thermal gap fillers
4 August 2010
New TP-S30 thermal interface pads from MH&W International provide 3,0 W/mK of thermal conductivity between hot components and heatsinks. Pads of TP-S30 thermal gap fillers are soft and compliant for easy ...

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Solder dross recycling system finds success
4 August 2010, Truth Electronic Manufacturing
The world price of solder is at an all time high, so reducing solder consumption – and therefore costs – should be on every electronics manufacturer’s wish list. On average, it is estimated that companies ...

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How to deposit thirty million glue dots per hour
4 August 2010, ZETECH ONE
In spite of all predictions, wave soldering is still alive and well. When the wave is fronted by a high-speed component placer, a high-speed glue deposition machine is also needed. Stencil printing has ...

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Antistatic gun
4 August 2010, RS South Africa
Milty’s Zero Stat Gun is an antistatic ‘generator’ with a ‘two cycle’ type of operation. When the trigger is squeezed, positive ions are generated and when the trigger is relaxed, negative ions flow. ...

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How solder wicking is related to reflow soldering
4 August 2010, Multimedia, Videos
Dataweek has partnered with the UK's National Physical Laboratory (NPL) to feature instructional videos on various defects encountered in the manufacturing of electronic printed circuit boards.    Industry ...

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The final match: China vs South Africa
4 August 2010, Microtronix Manufacturing, News
With the constant threat that is thrown at local contract manufacturers by our customers to take manufacturing ‘offshore’, myself and Microtronix’ MD, Michael Goodyer, thought it was time to visit the ...

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Dielectric for high-power LED lighting
21 July 2010
Optimised for high-power LED lighting and other applications requiring enhanced heat-transfer efficiency, Bergquist’s new HPL (high-power lighting) dielectric for Thermal-Clad substrates enables low operating ...

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Enclosed head solder print system
7 July 2010, ZETECH ONE
DEK’s ProFlow system for enclosed head printing technology has evolved to deliver greater electronics assembly performance, ease-of-use and environmental responsibility with ProFlow ATx. With the ability ...

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Job sequence optimiser
12 May 2010, MyKay Tronics
Mydata has released MYPlan version 4.1, which includes a new job sequence optimiser. The powerful optimisation algorithm calculates the best production sequence and changeover strategy, for any mix of ...

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Solder reflow oven
12 May 2010, Electronic Industry Supplies
Mekko’s new Euroflow 300C solder reflow oven design includes a new heater control system designed to overcome the problem of varying temperatures across the substrate, encountered with lead-free soldering. ...

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Instant adhesive for component tacking
12 May 2010
Permabond 820 is a modified ethyl cyanoacrylate that has a fast fixture time and high-temperature resistance, making it a good choice when bonding components in position on dual-sided PCBs prior to wave ...

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Moving AOI beyond the grey world
12 May 2010, ZETECH ONE
Most AOI (automatic optical inspection) systems deployed in the electronics assembly industry use greyscale image processing to inspect circuit boards and substrates. But some new generation equipment ...

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Sony releases new manufacturing lineup
12 May 2010
Sony Manufacturing Systems has introduced a new lineup called the ‘Green Line’ consisting of the visual inspection machine SI-V200, the high-speed pick-and-place machine SI-G200 and the solder paste printer ...

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'Design for manufacturability' guidelines
12 May 2010
South Africa has many brilliant electronic design engineers, whose innovative designs have succeeded both at home and internationally. But even the best among them are not necessarily familiar with the ...

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PCB cleaner for low-standoff components
12 May 2010, Electronic Industry Supplies
Zestron’s new VIGON A 201 is an MPC PCB cleaning agent that provides excellent cleaning performance in capillary spaces. Therefore flux residues even under low-standoff components, such as micro BGAs, ...

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Temperature profiling for PV manufacturing
12 May 2010, Testerion
Datapaq recently introduced three new products in its SolarPaq series for photovoltaic (PV) cell and module manufacturers. The systems are designed to provide temperature profiling solutions for the contact ...

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Pressure sensing film aids ultrasonic welding
12 May 2010
Ultrasonic welding (USW) is a joining technique that uses high-frequency ultrasonic acoustic vibrations to create solid-state welds. In the electronic, computer and electrical industries, ultrasonic welding ...

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KIC débuts next-generation Wave Surfer
12 May 2010
KIC has announced the release of the second generation Wave Surfer system. Wave Surfer is an easy-to-use, self-contained measurement system for wave solder machines that provides critical data on wave ...

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Analysis of resins used for potting and encapsulation
12 May 2010, Vepac Electronics
Resins used for potting and encapsulation applications can be of various chemical types. Epoxy resins have been widely used for many years – they are generally hard and tough and exhibit low shrinkage ...

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Intelligent evaporator system
12 May 2010
Aqueous Technologies’ new model E101 evaporator provides a zero-discharge environment for various aqueous cleaning systems such as defluxing equipment, stencil cleaning systems and other aqueous-based ...

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