Manufacturing / Production Technology, Hardware & Services


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New standards define revised test parameters for guaranteeing integrity of RoHS-compliant products
1 November 2006
Electronics reliability company, Gen3 Systems, has announced the release of revised surface insulation resistance (SIR) standards designed to improve reliability and integrity testing of products assembled ...

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New Pb-free technologies boost product reliability
18 October 2006
Reliability: there is no higher calling for today’s electronics assemblies. The newest generation of portable gaming devices, PDAs, mobile phones, laptops, and MP3 players are just a few of the products ...

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RoHS and lead-free: how the regulations impact you
4 October 2006, Testerion
The European RoHS (Restriction of Hazardous Substances) regulation is forcing the electronics industry to transition to lead-free soldering. Electronic production and rework facilities are currently reviewing ...

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Energy consumption minimised for the soldering process
4 October 2006, Testerion
For many years now, SMT, in Wertheim, Germany, has placed much importance on low energy consumption. With the updating of its product range, the company has applied its energy-saving policy, thanks to ...

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Universal enhances package-on-package flexibility
4 October 2006, ZETECH ONE
In response to rising demand for package-on-package (PoP) applications, Universal Instruments has developed new hardware and process technology to accommodate effective flux dipping and soldering for ...

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Industry-leading screen printing cycle times
4 October 2006, ZETECH ONE
DEK’s RTC (rapid transit conveyor) technology is currently presenting manufacturers around the world with an industry-first: repeatable core cycle time of just four seconds. According to the company, ...

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Software simplifies selective soldering programming
4 October 2006, ZETECH ONE
A new software tool that makes selective soldering set-up very fast and simple has been developed exclusively by Vitronics Soltec. With the Easyteach software, an operator uses a simple graphic image ...

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Traceability solution delivers brand protection for automotive manufacturers
4 October 2006, ZETECH ONE
Valor Computerized Systems, a productivity-enhancing solutions provider for the electronics industry, is witnessing rapid market share growth in the demanding automotive manufacturing industry with its ...

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Lead-free no-clean solder pastes have wide process window
4 October 2006, Electronic Industry Supplies
A new lead-free, no-clean solder paste that promotes wetting and minimises defects with tin/silver/copper alloy soldering has been unveiled by the Circuit Materials Division (CMD) of Heraeus. This new ...

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Experiments show lead-free pastes will give great results with 0201s
4 October 2006, ZETECH ONE
DEK has concluded research into screen printing for 0201 SMT components using SnPb and SAC solder pastes, highlighting new assembly and board design parameters for robust, high-volume assembly with minimal ...

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Lead-free - what to do? About the useful life of soldering tips
4 October 2006, Testerion
In addition to having a high melting point, lead-free solders are very aggressive towards metallic materials. Adapting the soldering parameters to the new process conditions required for lead-free soldering ...

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Philips committed to environmental issues
4 October 2006
Philips cooperates with leading suppliers and customers on a wide range of ‘green’ issues. Committed to environmental care, it was one of its factories that was the first in the world to receive ISO 14001 ...

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Use of digital X-ray imaging as a process control tool for lead-free PWB assembly
4 October 2006
The concerns for the environmental impact of increasing amounts of lead containing products within waste landfill sites have defined legislative and commercial pressure to implement lead-free solutions ...

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PCB manufacturing: controlling currents in the electroplating and electrolysis processes
4 October 2006, Denver Technical Products
Printed circuits boards (PCBs) used in the electronics world are sometimes produced by an electroplating process. Electroplating is the electrochemical process of depositing a metallic coating on a material ...

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Computerised tomography option available for x-ray inspection system
4 October 2006
Dage Precision Industries has developed a computerised tomography (CT) option for its XiDAT XD7600NT digital X-ray inspection system. This new CT option is available for the company's award-winning XD7600NT ...

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Zero defect wave solder set-up for lead-free
20 September 2006
Wave soldering with lead-free materials is probably the most demanding of the changes to traditional assembly methods due to the higher temperatures associated with the solder. Design plays a key role ...

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The transition to lead-free solder
20 September 2006
The electronics industry has grown up with tin/lead solder. The IEC defines these alloys as Sn60Pb40A, Sn63Pb37A or Sn62Pb36Ag02B. Over four decades the long-term performance of tin/lead alloys has been ...

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PCB solderability assessment - the industry standard
20 September 2006
Solderability testing has become more common in the industry particularly to assess components and printed board surface finishes during the transition to lead-free manufacture. The wetting balance is ...

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Auditing a contract manufacturer for lead-free capability
20 September 2006
Introduction of lead-free technology to your product involves every department in your company. Each engineer should understand the implications of lead-free even if you are exempt from existing legislation. ...

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About RoHS enforcement
20 September 2006
On 1 July 2006 the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2006 implementing the European Directive came fully into force. These regulations ...

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