Manufacturing / Production Technology, Hardware & Services


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Zero defect wave solder set-up for lead-free
20 September 2006
Wave soldering with lead-free materials is probably the most demanding of the changes to traditional assembly methods due to the higher temperatures associated with the solder. Design plays a key role ...

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The transition to lead-free solder
20 September 2006
The electronics industry has grown up with tin/lead solder. The IEC defines these alloys as Sn60Pb40A, Sn63Pb37A or Sn62Pb36Ag02B. Over four decades the long-term performance of tin/lead alloys has been ...

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PCB solderability assessment - the industry standard
20 September 2006
Solderability testing has become more common in the industry particularly to assess components and printed board surface finishes during the transition to lead-free manufacture. The wetting balance is ...

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Auditing a contract manufacturer for lead-free capability
20 September 2006
Introduction of lead-free technology to your product involves every department in your company. Each engineer should understand the implications of lead-free even if you are exempt from existing legislation. ...

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About RoHS enforcement
20 September 2006
On 1 July 2006 the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2006 implementing the European Directive came fully into force. These regulations ...

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Compact, modular soldering machine has quick programming
20 September 2006, ZETECH ONE
Circuit manufacturers who need an in-line capable selective soldering machine, that is quick to set up and well suited to a high product mix environment will find Vitronics Soltec's compact, modular mySelective ...

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Lead-free no-clean solder paste offers a variety of benefits
20 September 2006, Allan McKinnon & Associates (see Testerion)
Kester's Enviromark 918 (EM918) is a lead-free, halide-free, no-clean air or nitrogen, reflowable solder paste with probable residues and superior activity. According to the manufacturer, its clear residue, ...

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Silver conductive adhesive
20 September 2006, Electronic Industry Supplies
Heraeus' Circuit Materials Division has introduced newly-developed thermosetting, one-component, silver conductive adhesives. The new PC 3000-Series is solvent-free and its outstanding feature is an excellent ...

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Retaining springs to fit transistors to heatsinks
20 September 2006, Electrocomp
Facilitating the rapid and easy installation of semiconductor components, for example, transistors on heatsinks, reduces assembly costs considerably. For its existing range of heatsinks with special integral ...

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Printed board assemblies sag during lead-free wave soldering - but they do not have to with good design
6 September 2006
Today, the most common type of wave-soldering conveyor is the finger system. Although more expensive than the chain system, finger conveyors are more versatile as the conveyor may be opened and closed ...

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Climatic test chamber further improved
6 September 2006
Binder has improved its MKF series of climatic test chambers. The main advantage of this redesigned series, in addition to the technical improvements of its inherent features, is enhanced ergonomics and ...

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Reballing for reliable QFN rework
6 September 2006, ZETECH ONE
When electronic assemblies are reworked there should be no reduction in quality and reliability. This is why Martin has introduced new QFN Reballing Technology to allow desoldered and no longer useful ...

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SchmartBoard now for tiny discrete components
23 August 2006, KH Distributors
SchmartBoard, the developer of a technology that has simplified the creation of electronic circuits for hobbyists, students and electronic engineers, has released two new boards that address tiny discrete ...

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High-speed and performance chip feeder family
23 August 2006, ZETECH ONE
Universal has launched a family of feature-loaded spliceable tape feeders designed to boost the performance of high-speed chip placement equipment, while supporting line-level reporting and traceability ...

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'Dream Team' for QFNs shown at expo
9 August 2006, ZETECH ONE
Martin launched its 'Dream Team' for QFNs at the SMT 2006 show held in Nuremberg, Germany, recently. With its Rework-Dispenser and its Auto-Vision-Expert, the duo comprises an innovative machine pair ...

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Dissipative worksurface mats
9 August 2006, Actum
Altico Static Control Products offers a range of worksurface mats for electronics production in two stock sizes, on rolls or to customer requirements. The two-layer Economat rubber worksurface mat is ...

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Pocket printer to mark cables, wires and boards
9 August 2006
Grafoplast, a company that specialises in wire marking and identification products for the electrical and electronics industries, is offering a new pocket printer, the EGO4YOU. This battery-operated ...

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Breakthrough in ultra-thin leadless packaging
26 July 2006
Royal Philips Electronics has claimed a breakthrough in ultra-thin leadless packaging (UTLP) with two new packages for Logic and RF applications: MicroPakII and SOD882T. MicroPakII is the world's smallest ...

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Specifying, selecting and buying equipment
26 July 2006
SMT stencil printing may be a mature technology, but it is still the key to repeatable productivity and quality. To understand where the future of automatic stencil printing lies, it is helpful to review ...

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SMD technology now within anyone's reach
26 July 2006
A manual pick-and-place machine that is claimed to be easy to use, works fast, takes up limited space, and is affordable is being manufactured by Pretoria-based company Faze Electronics. The unit allows ...

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