Manufacturing / Production Technology, Hardware & Services


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The final match: China vs South Africa
4 August 2010, Microtronix Manufacturing, News
With the constant threat that is thrown at local contract manufacturers by our customers to take manufacturing ‘offshore’, myself and Microtronix’ MD, Michael Goodyer, thought it was time to visit the ...

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Dielectric for high-power LED lighting
21 July 2010
Optimised for high-power LED lighting and other applications requiring enhanced heat-transfer efficiency, Bergquist’s new HPL (high-power lighting) dielectric for Thermal-Clad substrates enables low operating ...

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Enclosed head solder print system
7 July 2010, ZETECH ONE
DEK’s ProFlow system for enclosed head printing technology has evolved to deliver greater electronics assembly performance, ease-of-use and environmental responsibility with ProFlow ATx. With the ability ...

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Job sequence optimiser
12 May 2010, MyKay Tronics
Mydata has released MYPlan version 4.1, which includes a new job sequence optimiser. The powerful optimisation algorithm calculates the best production sequence and changeover strategy, for any mix of ...

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Solder reflow oven
12 May 2010, Electronic Industry Supplies
Mekko’s new Euroflow 300C solder reflow oven design includes a new heater control system designed to overcome the problem of varying temperatures across the substrate, encountered with lead-free soldering. ...

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Instant adhesive for component tacking
12 May 2010
Permabond 820 is a modified ethyl cyanoacrylate that has a fast fixture time and high-temperature resistance, making it a good choice when bonding components in position on dual-sided PCBs prior to wave ...

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Moving AOI beyond the grey world
12 May 2010, ZETECH ONE
Most AOI (automatic optical inspection) systems deployed in the electronics assembly industry use greyscale image processing to inspect circuit boards and substrates. But some new generation equipment ...

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Sony releases new manufacturing lineup
12 May 2010
Sony Manufacturing Systems has introduced a new lineup called the ‘Green Line’ consisting of the visual inspection machine SI-V200, the high-speed pick-and-place machine SI-G200 and the solder paste printer ...

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'Design for manufacturability' guidelines
12 May 2010
South Africa has many brilliant electronic design engineers, whose innovative designs have succeeded both at home and internationally. But even the best among them are not necessarily familiar with the ...

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PCB cleaner for low-standoff components
12 May 2010, Electronic Industry Supplies
Zestron’s new VIGON A 201 is an MPC PCB cleaning agent that provides excellent cleaning performance in capillary spaces. Therefore flux residues even under low-standoff components, such as micro BGAs, ...

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Temperature profiling for PV manufacturing
12 May 2010, Testerion
Datapaq recently introduced three new products in its SolarPaq series for photovoltaic (PV) cell and module manufacturers. The systems are designed to provide temperature profiling solutions for the contact ...

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Pressure sensing film aids ultrasonic welding
12 May 2010
Ultrasonic welding (USW) is a joining technique that uses high-frequency ultrasonic acoustic vibrations to create solid-state welds. In the electronic, computer and electrical industries, ultrasonic welding ...

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KIC débuts next-generation Wave Surfer
12 May 2010
KIC has announced the release of the second generation Wave Surfer system. Wave Surfer is an easy-to-use, self-contained measurement system for wave solder machines that provides critical data on wave ...

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Analysis of resins used for potting and encapsulation
12 May 2010, Vepac Electronics
Resins used for potting and encapsulation applications can be of various chemical types. Epoxy resins have been widely used for many years – they are generally hard and tough and exhibit low shrinkage ...

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Intelligent evaporator system
12 May 2010
Aqueous Technologies’ new model E101 evaporator provides a zero-discharge environment for various aqueous cleaning systems such as defluxing equipment, stencil cleaning systems and other aqueous-based ...

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Pick-and-place option identifies PCBs
12 May 2010
Essemtec introduced a new option for SMD placement machines allowing them to identify a PCB using a barcode label. This enables the assignment of all placement and component data uniquely to a specific ...

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In-line AOI system
12 May 2010
At the recently held APEX 2010 show, Mirtec exhibited the latest in its MV-7 series – the MV-7xi in-line AOI system. Fully configured, this system provides one top-down view, five megapixel camera, with ...

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Lab optimises dispensing solutions
12 May 2010, ZETECH ONE
Martin has opened an in-house laboratory to assist customers in finding solutions for specific dispensing applications. Whether the application is adhesive, grease, oil or solder paste, the company is ...

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Stencil cleaning material
12 May 2010
Cobar has announced the launch of Cobar MCI-2330, a new stencil cleaning agent. MCI-2330 is developed for the removal of solder paste and adhesive residues from all types of stencils. Additionally, it ...

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Dual-jet liquid dispensing machine
12 May 2010
Essemtec recently introduced the CDS6200 automatic liquid dispensing machine with two jet dispensers. This jet dispensing technology allows proportioning of various media at a large number of points. ...

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