Manufacturing / Production Technology, Hardware & Services


Latest Articles

Lead-free reflow puts new demands on rework equipment
5 May 2004, ZETECH ONE , Security Services & Risk Management
Lead-free solder is a subject that must be addressed today because it will be a requirement soon. The process parameters required for high reliability solder joints put new and tougher demands on reflow ...

Read more...
Customer-specific heatsinks and milled components
5 May 2004, Electrocomp
Although a large number of technical components have been standardised, especially in the field of heatsinks, 'special parts' meeting specific requirements are always needed and cannot be replaced by ...

Read more...
Protecting and insulating grease
5 May 2004
S-97 from Due-Ci is a highly protective, insulating and colourless grease designed to protect electronic and electrical equipment frequently exposed to electromagnetic or RF interference, high temperatures, ...

Read more...
Do not be afraid of lead-free soldering
21 April 2004, ZETECH ONE
1 July 2006 will be the day when lead-free soldering finally becomes law for the manufacturers and suppliers of electronic components in Europe. Time is running short and many small- and medium-sized ...

Read more...
Lead-free information on Schurter website
21 April 2004, Retron
Schurter has enhanced its website with more lead-free product information. It has structured the content and added a table of contents. Certain fragments can be downloaded as separate PDF files, optimised ...

Read more...
Introducing the '5 steps to successful lead-free soldering'
7 April 2004, ZETECH ONE , Associations
Electronics manufacturers worldwide are moving to lead-free solders for a variety of reasons that include environmental concerns and compliance with impending regulatory legislation. The development of ...

Read more...
Quick drying insulating lacquer
7 April 2004
Due-Ci's V-66 insulating lacquer dries fast (between 15 to 30 minutes drying time). This forms a clear, tough and transparent coating will not fragment, chip or crack. V-66 offers a very high dielectric ...

Read more...
Colloidal graphite spray
7 April 2004, Information Security
Colloidal graphite-based spray can make surfaces conductive. Due-Ci's N-77 leaves a thin silver-grey film that adheres to plastic, metal, wood, glass, ceramics. It can be used to coat the housings of ...

Read more...
Insulating clamps for power transistors
7 April 2004, Electrocomp
Electrically insulated installation of transistor cases can be safely and simply achieved using insulating clamps. Fischer Elektronik offers clamps for type TO218, TO220 and TO247 transistors. A pin ...

Read more...
Automated programming system
7 April 2004
The PS288FC automated device programming system from Data I/O, is ideal for programming small to medium batches, accommodating unpredictable batch sizes and continually changing programming demands. The ...

Read more...
In-line/standalone modular selective soldering machine
7 April 2004
Designed for both small and large batch 'selective soldering' the Topaz E series from Pillarhouse is suited for both the large manufacturer and small subcontractor. Based upon the low-cost principle of ...

Read more...
HMI panels Web-enable up to five serial protocols
April 2004, Enclosures, Cabling & Connectors
Micropower Instrumentation is offering Red Lion Controls' G3 HMI Series - a family of operator panels that offer up to five communication ports, as well as next generation software and a built-in gateway ...

Read more...
Tabletop-sized ultrasonic stencil cleaner
24 March 2004, ZETECH ONE
The Model 500 Tabletop Ultrasonic Stencil Cleaner from Smart Sonic is designed to clean 510 mm stencils, but can also effectively clean 740 mm stencils by simply using two cleaning cycles. It will wash ...

Read more...
Variable range of industrial cases
24 March 2004
The practical, large-volume Meditec case system from OKW is used particularly in the fields of measuring and control engineering, medical and laboratory technology as well as in telecoms. This series ...

Read more...
Solder paste for high speed lines
24 March 2004
A halide-free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue is available from Indium Corporation. The residue from the NC-SMQ92J solder paste is easily penetrated ...

Read more...
Advanced packaging alternative to 'known good die'
24 March 2004, ASIC Design Services
Actel has introduced an advanced packaging technology small enough to enable the assembly of tested and programmed FPGAs into multichip modules (MCMs) for applications in Space. Capable of delivering ...

Read more...
Infineon 'Greener' with robust package
10 March 2004, Electrocomp, Information Security
As a result of recent environmental concerns regarding the use of lead, the requirements for lead-free semiconductors have been receiving increasing attention within the electronics industry. Current ...

Read more...
Models added to rotary control knob ranges
10 March 2004
Elma Electronic has expanded its range of rotary control knobs with the launch of 118 different 'soft feel' and conventional knobs for 4 mm, 6 mm and 1/4" shafts. Available in a range of plain and lined ...

Read more...
Heatsinks with lock-in transistor retaining springs
10 March 2004, Electrocomp
Simplified transistor fastening on heatsinks with a reduction in cost is possible using a new series of extruded heatsinks and lock-in springs made by Fischer Elektronik. The special geometry of the groove ...

Read more...
Square tube cases
10 March 2004, Electrocomp
Fischer Elektronik has extended its professional tube case system by a second version in square design and with IP54 protection. This rugged case is the 'big brother' of TUG05 with its innovative use ...

Read more...



<< First   < Previous   Page 106 of 123   Next >   Last >>







While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved