Manufacturing / Production Technology, Hardware & Services


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Rugged desoldering pump
5 August 2009
This new desoldering pump from AP Electronics is built to be strong and offer long usage life. The main body is made out of aluminium with high-quality anti-slip finger grips. The tip is made from reinforced ...

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Universal prototyping station
24 June 2009
Essemtec recently débuted the Expert-SAFP universal prototyping station, allowing for small batches and prototypes of assembled SMD boards to be mounted with its semi-automatic pick-and-place system. ...

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How to successfully outsource electronic manufacturing
13 May 2009
Some of the benefits an OEM should be aiming to achieve from outsourcing include better utilisation of their own resources, reduced operating costs and overheads, thus reducing risk, and reduced capital expenditure

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High-speed modular chip shooter
13 May 2009, Allan McKinnon & Associates
The successor to the KE-2050, Juki’s new KE-2070 is a sixth generation high-speed modular chip shooter. Built upon the one-piece SuperCast single casting base that includes the Y beams, the machine is ...

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Selective soldering with PCB warpage compensation
13 May 2009, ZETECH ONE
Vitronics Soltec now offers PCB warpage compensation as a feature of its advanced mySelective 6748 selective soldering machines. This compensation ensures that the points to be soldered on an assembly ...

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Easy-to use thermal profiling system
13 May 2009, Electronic Industry Supplies
ECD has announced the introduction of a new product in its line of thermal profiling products. Designed to complement both board profilers such as the 20-channel MEGAM.O.L.E.20 and the SuperM.O.L.E. Gold, ...

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Digital X-ray inspection system
13 May 2009
Dage Precision Industries has announced the introduction of its new XD7600NT100 digital X-ray inspection system with 100 nanometre feature recognition for finite analysis of challenging inspection applications. ...

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Solder paste jet printer
13 May 2009, MyKay Tronics
With its second generation of the MY500 series, Mydata has developed a jet printer capable of shooting solder paste with-out touching the PCB. Because jet printing requires no stencils, this offers ...

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Mydata's new pick-and-place generation
13 May 2009, MyKay Tronics
Mydata recently introduced its newest generation of pick-and-place machines. The MY100 series is a completely new placement machine platform which broadens the company’s product range to suit even higher ...

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High-speed chip shooter from Samsung
13 May 2009
The SM411 from Samsung achieves placement speed of 42 000 components per hour for chips and 30 000 components per hour for SOP parts (based on IPC, respectively) by adopting a dual gantry mechanism and ...

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Hot-print and transfer prebumping offer benefits
13 May 2009, ZETECH ONE
It is no secret in the electronics industry that there is an ongoing trend to ever more miniaturised and advanced IC packages which also feature higher performance and provide even more advantages. One ...

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Automatic label placer
13 May 2009
Promation has announced the release of its new auto label placement system. The ELC-1100P is an automatic label generation and placement work cell that is used for in-line processing of PCBs that require ...

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Phase change thermal interface material
13 May 2009
Bergquist has introduced the latest in thermally conductive phase change materials, Hi-Flow 565U and Hi-Flow 565UT. Both materials perform like high-end thermal greases, yet can be applied in pad form, ...

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Semi-automatic screen/stencil printer
13 May 2009
Essemtec’s new SP150 is a semi-automatic system with integrated stencil cleaning, controlled printing process and digital vision system, targeted at the long-term demands of many small and medium size ...

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Intelligent shopfloor software solution
13 May 2009, Allan McKinnon & Associates
Juki recently premiered its Intelligent Shopfloor (IS) solution, a complete production support system composed of five specialised pieces of software: Intelli PE for creating production programs, Intelli ...

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MSD handling: desiccants and nitrogen, myths and opportunities
13 May 2009
To avoid problems with micro cracks and delaminating during the processing of electronic components, it is necessary to take appropriate storage into account. Since the introduction of lead-free soldering ...

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The significance of the stencil printing process
13 May 2009
I still remember an incident that happened a few years ago, when I was called out to a customer to look at a ‘problem’ on their pick-and-place machine, where it was ‘throwing the components around’. I ...

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SMD placement machine for small and mid-sized production
13 May 2009
The Pantera–XV SMD placement machine from Essemtec directly addresses prototyping and production runs in mid-sized quantities. The system provides high placement accuracy and speed, a broad application ...

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Tellumat Electronic Manufacturing - the importance of being first
18 February 2009
The technology-driven global economy requires companies to be fast, efficient and adaptive. One of the key drivers is to be first to market with innovative products. In the past, companies could afford ...

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Prevent occupational asthma with fume extraction
18 February 2009, Allan McKinnon & Associates
Fumes and gases in industrial areas are very often dangerous to the people working in these areas. Some of these products are visible, but others are not visible or even noticeable. Many of these fumes ...

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