Manufacturing / Production Technology, Hardware & Services


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Basic probe fixturing for board testing
7 May 2003, Products & Solutions
Spring contact probes are used as the interconnection medium between the unit under test (UUT) and the tester. This article gives a general discussion of probe fixturing, limited to the most common types ...

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Universal enclosures for industrial applications
7 May 2003, Actum
Especially developed for use in applications that fall between single card enclosures and 19" racks, Erni's LDG-D housings are available in three sizes - 6, 10 or 20 connections. These enclosures are ...

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Housings with plug-in connection
7 May 2003, Actum, Products & Solutions
Erni's LDG-A miniature housings with frame insert and receptacle for a separate multipoint connector are now available in A16, A30 and A46 versions. Depending on assembly they offer maximum component ...

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Control enclosure for building automation
7 May 2003
Bopla's Bovista enclosure system is designed especially for use in building automation systems. However, the wide range of ways of combining lids and bases ensures that this plastic enclosure can also ...

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512 Kb serial EEPROM in low-profile DFN package
23 April 2003, Tempe Technologies
Microchip says that its new 512 Kb I2C compatible serial EEPROMs are the first to be available in an 8-pad dual flat no-lead package. The 6 x 5 x 0,9 mm DFN packages are ideal for low-headroom applications, ...

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'Easy-to-use' starter kit to explore reprogrammable FPGA devices
23 April 2003, ASIC Design Services
Actel released a low-cost starter kit for its cost-competitive flash-based, reprogrammable ProASICPLUS field-programmable gate array (FPGA) devices. The ProASICPLUS Starter Kit is a complete package consisting ...

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Via filling process improved
23 April 2003, ZETECH ONE
Developed in response to customer requirements, DEK has announced that its new Via Fill process delivers 100% fill of substrate vias with no voids and minimal surface residue. The technique uses DEK's ...

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University program expanded to include FPGA synthesis solution and ASIC prototyping software
9 April 2003
The Synplicity University Program provides universities worldwide with easy-to-use, state-of-the-art commercial development software

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Flow monitoring
9 April 2003, ZETECH ONE
PVA's inline flow monitoring systems allow precise data feedback on material quantities applied during each application cycle. This data can be displayed on the front panel LCD screen, downloaded to a ...

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Programmable system-on-chip: the next level
26 March 2003, ASIC Design Services
Programmable logic vendors have now introduced devices with performance that rivals ASIC designs, without the cost of a $1-million mask set, or minimum volume requirements. To achieve this high-performance ...

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New platform redefines semi-automatic performance
26 March 2003, ZETECH ONE
DEK claims it has raised the performance of semi-automatic screen printers, by introducing the Viking-class Horizon 05 platform featuring fully automatic vision alignment, the DEK adjustable stencil mount ...

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Handheld case for a good grip
26 March 2003
The new Hand-Terminal M series of cases from OKW has been specially developed for rough conditions and for all areas requiring a particularly robust and waterproof handheld case. Designed as a three-piece ...

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Silicone-free form-in-place gasketing material
12 March 2003
Laird Technologies' non-silicone based form-in-place gasketing compound (SNNSF) is ideal for critical applications where concerns over silicone migration or contamination exist, such as in the telecommunications ...

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Optical inspection system sees the low-down
12 March 2003, Test & Rework Solutions
Metcal's innovative VPI-1000 optical inspection system adds features and flexibility to traditional optical inspection while offering customers an economical inspection solution. According to the company, ...

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Protector for handheld case
12 March 2003
OKW Gehäusesysteme has developed the Datec-Control handheld case range in four sizes (XS, S, M and L) specially for the installation of graphics-capable displays. The latest accessory for this range is ...

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Precision X-ray imaging for BGA, Flip Chip, CSP, IC inspection
26 February 2003
Glenbrook Technologies' 'Jewel Box' is a realtime X-ray inspection system claimed to deliver superior image quality for laboratory and failure analysis applications. The system's high-resolution X-ray ...

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Planar coilformers with solder connect
26 February 2003, Sivan Electronic Supplies, Associations
Planar coilformers with solder-connections were developed by Norwe for individual and easily changeable winding designs. Electrical connections are via solder-pins located outside ...

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Rework system offers the accuracy and control essential for new array packages
26 February 2003, Test & Rework Solutions
Metcal claims its versatile APR-5000 Array Package Rework System offers the repeatability, accuracy and thermal control essential for the safe and effective rework of today's leading-edge BGA, CSP, land ...

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SMT mounter for small-sized and narrow components
26 February 2003, Surveillance
Yamaha has introduced the Mini Module Mounter YT-16, which it has dubbed 'ThreeM'. This SMT mounter is used in the production of a small-sized and narrow components type of printed circuit board. Set ...

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More than counting black dots: What does X-ray inspection of hidden BGA solder joints reveal?
26 February 2003, ZETECH ONE
Microfocus X-ray inspection has become a generally accepted method to control the quality of board assemblies, and to analyse defects of hidden solder joints. And it is key to efficient implementation ...

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