Archive



2021 ▾

24 November 2021: Feature Articles

  • One LoRa node to find them all
  • Products of the Year 2021
  • Personality profile: Doug Gunnewegh
  • From the editor's desk: Weather forecast – partly sunny, moderately windy, opportunities on horizon
  • Signal chain implementation for condition monitoring systems
  • World-first demo of wireless-powered 5G base station


27 October 2021: Feature Articles

  • Water, water everywhere and not a drop to drink
  • Omnigo’s TestBench offers a reliable test base to meet a multitude of test requirements
  • Thermal management in high-performance RF and microwave PCBs
  • LPWAN markets and applications
  • SDR transceiver delivers big advances in frequency hopping
  • Installation considerations for open-frame and U-channel power supplies


29 September 2021: Feature Articles

  • Personality profile: Hannes Taute
  • A technical overview of three top LPWAN architectures
  • Wits researchers turn Jozi into live lightning research lab
  • Improving precision ADC signal chain design time with CTSDs
  • Prototype chip decodes any type of data sent across a network
  • Construction of world’s largest radio telescope arrays green-lighted


25 August 2021: Feature Articles

  • iCorp Technologies – ‘We don’t sell components, we provide solutions’
  • The LPWAN state of play in SA
  • Personality profile: Daniel Haywood
  • Optical design for ToF depth sensing cameras
  • Modern trends are shaping new power connectors
  • The evolution of heavy-duty connectors


28 July 2021: Feature Articles

  • Component shortages persist, but hope is in sight
  • Thermal profiling is integral to a process in control
  • Personality profile: Derick Smalberger
  • How to ensure end-to-end security for embedded systems
  • Why realistic voltage sources should be considered when designing a reliable power supply


23 June 2021: Feature Articles

  • From the editor's desk: All fall down
  • Personality profile: Tau Ndhleleni
  • Electronics light the road ahead for the agriculture sector
  • The dangers of gut-feel engineering
  • Designing better comms systems, from factories to operating rooms
  • Choosing the right approach for power supply selection and design


26 May 2021: Feature Articles

  • A tribute to Mark Schroeder
  • IBM shrinks chip geometries to 2 nm
  • Intel Agilex FPGAs deliver flexibility and agility for the data-centric world
  • Preparing for a 5G world
  • Reliable grounding methods for high-voltage power supplies


28 April 2021: Feature Articles

  • From the editor’s desk: We’re still just circling the problem of e-waste
  • Challenges for electronic circuits in space applications
  • Electronic warfare: Vying for control of the electromagnetic spectrum
  • Personality profile: Renato Martins
  • Preparing IoT designers for next-generation cyberattacks


31 March 2021: Feature Articles

  • Component shortages and how to mitigate them
  • Strength to the tech industry despite the pandemic
  • Is your dry storage J-standard compliant?
  • The power of 2D and 3D X-ray inspection
  • Beating the best with artificial intelligence
  • Multi-parameter vital signs monitoring is easier than ever before


26 February 2021: Feature Articles

  • 5G and IoT in 2021
  • Personality profile: Bossie Coetzer
  • The current state of GaN use for RF technology
  • Modern LIDAR systems promise sensing for every industry
  • How do fusion splicers work?


EMP 2021 Electronics Manufacturing & Production Handbook: Feature Articles

  • The same old new normal
  • A comprehensive guide to X-ray inspection
  • SMT reflow oven-to-oven repeatability
  • A match made in car alarm heaven
  • Conformal coatings vs. encapsulation resins – making an informed choice
  • An introduction to counterfeit components and testing








While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved