Archive



2026 ▾

29 June 2026: Feature Articles

  • Engineering for failure: why resilient telemetry matters more than perfect connectivity
  • PEAK’s first automotive Ethernet solution
  • From the editor's desk: The art of measuring the truth
  • Lesley Havenga: Building partnerships for Africa’s electronics future
  • Generating negative voltages from a positive supply
  • Solving South African power problems with locally built intelligence


29 May 2026: Feature Articles

  • Case Study: Turning data into insight
  • EMC limits and levels
  • High-power RF amplifier design best practices
  • Photonics solutions for manufacturing excellence
  • Sigfox SA powers smart connectivity
  • Seeing through the noise
  • What happens when trust can no longer live only in software?


28 April 2026: Feature Articles

  • Designing with PCIe
  • From the editor's desk: How electronics and AI are transforming the battlefield
  • Telemetry powering South Africa’s industry
  • Understanding two key tools for cleaner serial data
  • Connected without limits: An engineering perspective on Altron Arrow’s wireless ecosystem


30 March 2026: Feature Articles

  • Designing IoT devices for deterministic LPWAN environments
  • Engineering in a world that cannot assume connectivity
  • Resilient navigation in warfare: The role of non-GNSS
  • Driving excellence in electronics manufacturing
  • In sync with the line


28 February 2026: Feature Articles

  • A two-stage approach to super-wide input voltage range DC-DC converters
  • From the editor's desk: Engineering the future
  • Quectel’s RG255C-NA and RM255C-GL accelerate 5G RedCap adoption
  • Surviving the extremes: Understanding shock and vibration in MEMS sensors
  • SDRs – Which RF architecture should you choose?


EMP 2026 Electronics Manufacturing & Production Handbook: Feature Articles

  • From the editor's desk: Could X-ray lithography disrupt the economics of advanced chip manufacturing?
  • Barracuda commissions new IPC Class 3 aerospace facility
  • Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
  • Understanding solder dross: causes and control strategies








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