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Electronics Buyers' Guide

Electronics Manufacturing & Production Handbook 2019


26 September 2001

  Digital chicken or cyber egg - which should come first?
Telecoms, Datacoms, Wireless, IoT

From London to New York, the Internet has certainly changed the face of both business and recreation activities but in Malawi and Mozambique, life remains very much the same

 
  Local ISPs should copy the business strategies of CLECs in the USA
Telecoms, Datacoms, Wireless, IoT

Those CLECs in the US, for instance, who are surviving and attracting new customers, do not provide the entire infrastructure themselves - they often leverage off the infrastructures already established by other third parties

 
  Speeding up the last mile
Electrocomp, Telecoms, Datacoms, Wireless, IoT

Of the various broadband transmission technologies available for the last mile, digital subscriber line (DSL) technology currently offers the greatest prospects

 
  Current telecom downturn will slow but not stall VoIP efforts
News

"Certain types of applications that are dependent on longer term market forces associated with infrastructure development will weather the storm better than more speculative areas such as enhanced services."

 
  Electronic all-rounders
Electrocomp, News

There is virtually no application in electrical engineering or electronics that can do without film capacitors from Epcos

 
  Introduction to industrial networking
Telecoms, Datacoms, Wireless, IoT

 
  Open solutions delivery without breaking the bank
Telecoms, Datacoms, Wireless, IoT

Leading the way in this fast-growing market are the new RAS concentrators from Digi with as many as 60 high-density modem channels or ISDN B channel connections over T1/E1/PRI lines in a single PCI slot

 
  Pinetown-based company designs and manufactures SA's first Linux Thin Client
News

The new Uniterm Linux-powered Thin Client was designed and introduced to stem competition from products manufactured in the East

 
  Tooling turned into automatic reality
Zetech, Manufacturing / Production Technology, Hardware & Services

"The idea was to increase the number of pins actually in contact with a given area of the assembly, compared with conventional tooling, to reduce the average individual component contact pressure"

 
Events
News
Analogue, Mixed Signal, LSI
Computer/Embedded Technology
Design Automation
DSP, Micros & Memory
Interconnection
Manufacturing / Production Technology, Hardware & Services
Opto-Electronics
Passive Components
Power Electronics / Power Management
Switches, Relays & Keypads
Telecoms, Datacoms, Wireless, IoT
Test & Measurement

 
 
         
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